# US 10,455,643 B2 · Thick film element having covering layer with high heat conductivity

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- Number: US 10,455,643 B2
- Document ID: US10455643B2
- Status: Granted
- Kind: B2
- Application number: 15/534,487
- Filed: 2016-03-26
- Published: 2018-12-06
- Granted: 2019-10-22
- Earliest claimed: 2016-02-03
- Assignees: Guangdong Flexwarm Advanced Materials & Technology Co., Ltd.
- Applicants: Guangdong Flexwarm Advanced Materials & Technology Co., Ltd.
- Inventors: Weicong Huang
- Web page: https://patentgrep.com/patent/US10455643B2

## CPC

- H05B 3/12: characterised by the composition or nature of the conductive material
- F28F 3/04: the means being integral with the element
- H05B 3/02: Details
- H05B 3/22: non-flexible
- H05B 3/34: flexible, e.g. heating nets or webs
- H05B 2203/01: Heaters comprising a particular structure with multiple layers
- H05B 2203/013: Heaters using resistive films or coatings
- H05B: ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- F28F: DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION (water and air traps, air venting F16)

## Abstract

The present invention provides a thick film element having a covering layer with high heat conductivity, which comprises a carrier, a thick film coating deposited on the carrier and a covering layer overlaid on the coating. The thick film coating is a heating materials, and the mode of heating is electrical heating. The covering layer, the thick film coating and the carrier are selected from a material that fulfills every of the following equations: λ 1 ⁢ A ⁢ T 1 - T 0 d 1 = a × λ 3 ⁢ A ⁢ T 3 - T 0 d 3 , ⁢ λ 2 ⁢ A ⁢ T 2 - T 0 d 2 = b × λ 1 ⁢ A ⁢ T 1 - T 0 d 1 , ⁢ λ 2 ⁢ A ⁢ T 2 - T 0 d 2 = c × λ 3 ⁢ A ⁢ T 3 - T 0 d 3 ; wherein 200≤a≤104, 0<b≤1000, 0<c≤5×105. The covering layer of the thick film element of the present invention has high heat conductivity, and is suitable for coating products with a single-sided heating covering layer. The present invention improves heat transfer efficiency and reduces heat loss when double-sided heating is not required.

## Claims

### Claim 1

A thick film element having a covering layer with high heat conductivity, comprising: a carrier; a thick film coating deposited on the carrier; and a covering layer overlaid on the coating, wherein the thick film coating is a heating material, and a mode of heating is electrical heating, wherein the carrier, the thick film coating and the covering layer are selected from a material that fulfills every of following equations:
λ
1
⁢
A
⁢
T
1
-
T
0
d
1
=
a
×
λ
3
⁢
A
⁢
T
3
-
T
0
d
3
,
λ
2
⁢
A
⁢
T
2
-
T
0
d
2
=
b
×
λ
1
⁢
A
⁢
T
1
-
T
0
d
1
,
⁢
λ
2
⁢
A
⁢
T
2
-
T
0
d
2
=
c
×
λ
3
⁢
A
⁢
T
3
-
T
0
d
3
;
wherein 200≤a≤104, 0<b≤1000, 0<c≤5×105;
T2<TMinimum melting point of the covering layer;
T2<TMinimum melting point of the carrier;
T0≤30° C.;
wherein a value of
λ
1
⁢
A
⁢
T
1
-
T
0
d
1
represents a heat transfer rate of the covering layer;
a value of
λ
2
⁢
A
⁢
T
2
-
T
0
d
2
represents a heat generating rate of the thick film coating;
a value of
λ
3
⁢
A
⁢
T
3
-
T
0
d
3
represents a heat transfer rate of the carrier;
λ1 represents a heat conductivity coefficient of the covering layer at a temperature of T1;
λ2 represents a heat conductivity coefficient of the thick film coating at a temperature of T2;
λ3 represents a heat conductivity coefficient of the carrier at a temperature of T3;
A represents a contact area of the thick film coating with the covering layer or the carrier;
d1 represents a thickness of the covering layer;
d2 represents a thickness of the thick film coating;
d3 represents a thickness of the carrier;
T0 represents an initial temperature of the thick film heating element;
T1represents a surface temperature of the covering layer;
T2 represents a heating temperature of the thick film coating;
T3 represents a surface temperature of the carrier;
d2≤50 μm; 10 μm≤d1≤10 mm, d3≥10 μm;
TMinimum melting point of the carrier>25° C.; and λ1≥λ3.

### Claim 2 (depends on 1)

The thick film element according to claim 1, wherein the heat conductivity coefficient λ3 of the carrier is smaller than or equal to 3 W/m·k, the heat conductivity coefficient λ1 of the covering layer is larger than or equal to 3 W/m·k, and 200≤a≤104, 10≤b≤1000, 104≤c≤5×105.

### Claim 3 (depends on 2)

The thick film element according to claim 2, wherein a region between the carrier and the covering layer without the thick film coating is bound by printing, coating, spraying or sintering, or gluing.

### Claim 4 (depends on 1)

The thick film element according to claim 1, wherein the carrier and the thick film coating are bound by printing or sintering, and the thick film coating and the covering layer are bound by printing, sintering, or vacuum.

### Claim 5 (depends on 1)

The thick film element according to claim 1, wherein the carrier comprises polyimides, organic insulating materials, inorganic insulating materials, ceramics, glass ceramics, quartz, stone materials, fabrics and fiber.

### Claim 6 (depends on 1)

The thick film element according to claim 1, wherein the thick film coating is one or more of silver, platinum, palladium, palladium oxide, gold and rare earth materials.

### Claim 7 (depends on 1)

The thick film element according to claim 1, wherein the covering layer is made from one or more of polyester, polyimide or polyetherimide (PEI), ceramics, silica gel, asbestos, micarex, fabric and fiber.

### Claim 8 (depends on 1)

The thick film element according to claim 1, wherein an area of the thick film coating is smaller than or equal to an area of the covering layer or an area of the carrier.

### Claim 9

An use of a thick film element for coating products having a single-sided heating covering layer, wherein the thick film element has a covering layer with high heat conductivity and comprises: a carrier; a thick film coating deposited on the carrier; and a covering layer overlaid on the coating, wherein the thick film coating is a heating material, and a mode of heating is electrical heating, wherein the carrier, the thick film coating and the covering layer are selected from a material that fulfills every of following equations:
λ
1
⁢
A
⁢
T
1
-
T
0
d
1
=
a
×
λ
3
⁢
A
⁢
T
3
-
T
0
d
3
,
λ
2
⁢
A
⁢
T
2
-
T
0
d
2
=
b
×
λ
1
⁢
A
⁢
T
1
-
T
0
d
1
,
⁢
λ
2
⁢
A
⁢
T
2
-
T
0
d
2
=
c
×
λ
3
⁢
A
⁢
T
3
-
T
0
d
3
;
wherein 200≤a≤104, 0<b≤1000, 0<c≤5×105;
T2<TMinimum melting point of the covering layer;
T2<TMinimum melting point of the carrier;
T0≤30° C.;
wherein a value of
λ
1
⁢
A
⁢
T
1
-
T
0
d
1
represents a heat transfer rate of the covering layer;
a value of
λ
2
⁢
A
⁢
T
2
-
T
0
d
2
represents a heat generating rate of the thick film coating;
a value of
λ
3
⁢
A
⁢
T
3
-
T
0
d
3
represents a heat transfer rate of the carrier;
λ1 represents a heat conductivity coefficient of the covering layer at a temperature of T1;
λ2 represents a heat conductivity coefficient of the thick film coating at a temperature of T2;
λ3 represents a heat conductivity coefficient of the carrier at a temperature of T3;
A represents a contact area of the thick film coating with the covering layer or the carrier;
d1 represents a thickness of the covering layer;
d2 represents a thickness of the thick film coating;
d3 represents a thickness of the carrier;
T0 represents an initial temperature of the thick film heating element;
T1 represents a surface temperature of the covering layer;
T2 represents a heating temperature of the thick film coating;
T3 represents a surface temperature of the carrier;
d2≤50 μm; 10 μm≤d1≤10 mm, d3≥10 μm;
TMinimum melting point of the carrier>25° C.; and λ1>λ3.

### Claim 10 (depends on 9)

The use of the thick film element according to claim 9, wherein the heat conductivity coefficient λ3 of the carrier is smaller than or equal to 3 W/m·k, the heat conductivity coefficient λ1 of the covering layer is larger than or equal to 3 W/m·k, and 200≤a≤104, 10≤b≤1000, 104≤c≤5×105.

### Claim 11 (depends on 10)

The use of the thick film element according to claim 10, wherein a region between the carrier and the covering layer without the thick film coating is bound by printing, coating, spraying or sintering, or gluing.

### Claim 12 (depends on 9)

The use of the thick film element according to claim 9, wherein the carrier and the thick film coating are bound by printing or sintering, and the thick film coating and the covering layer are bound by printing, sintering, or vacuum.

### Claim 13 (depends on 9)

The use of the thick film element according to claim 9, wherein the carrier comprises polyimides, organic insulating materials, inorganic insulating materials, ceramics, glass ceramics, quartz, stone materials, fabrics and fiber.

### Claim 14 (depends on 9)

The use of the thick film element according to claim 9, wherein the thick film coating is one or more of silver, platinum, palladium, palladium oxide, gold and rare earth materials.

### Claim 15 (depends on 9)

The use of the thick film element according to claim 9, wherein the covering layer is made from one or more of polyester, polyimide or polyetherimide (PEI), ceramics, silica gel, asbestos, micarex, fabric and fiber.

### Claim 16 (depends on 9)

The use of the thick film element according to claim 9, wherein an area of the thick film coating is smaller than or equal to an area of the covering layer or an area of the carrier.