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US 10,451,974 B2Granted
Rinse composition, a method for forming resist patterns and a method for making semiconductor devices
AssigneeAz Electronic Materials (Luxembourg) S.A.R.L.
InventorsKazuma Yamamoto, Yuriko Matsuura, Tomoyasu Yashima, Tatsuro Nagahara
Life of this patent
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Abstract
The present invention relates to a new rinse composition, the forming of resist patterns using the rinse composition, and a semiconductor device manufacturing method using the rinse composition in a photolithography method.
Claims11
A rinse composition comprising a surfactant represented by below formula (I), a C2-C16 diol derivative, and water,
- wherein X is an oxygen, nitrogen or carbon,
- R1, R2 and R3 are independently hydrogen, fluorine or C1-5 alkyl,
- Y is a hydrogen, fluorine, or C1-5 alkyl,
- each Z is independently hydrogen, fluorine, or C1-5 alkyl,
- or Y and Z are taken together to form a single bond,
- l is 1, 2, 3, 4 or 5,
- m is 0, 1, 2, 3, 4 or 5, and
- n is 0, 1 or 2 and
- wherein the diol derivative is represented by below formula (II),
- wherein R4, R5 R6 and R7 are independently hydrogen, fluorine or C1-5 alkyl,
- L1 and L2 are independently C1-5 alkane linker, C2-4 alkene linker or C2-4 alkyne linker,
- L1 and L2 are independently unsubstituted, or substituted by fluorine, C1-5 alkyl, or hydroxyl, and
- o is 0, 1 or 2.
10 more elements
Dependencies are inferred from the claim text.