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US 10,449,764 B2Granted
MEMS device, liquid ejecting head, liquid ejecting apparatus, manufacturing method of MEMS device, and manufacturing method of liquid ejecting head
AssigneeSeiko Epson Corporation
InventorsEiju Hirai, Yoichi Naganuma, Toshiaki Hamaguchi, Motoki Takabe
Life of this patent
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Abstract
A MEMS device includes a first substrate; a second substrate that is disposed laminated on the first substrate; and a functional element that is disposed between the first substrate and the second substrate, in which the second substrate is smaller than the first substrate, and in planar view, an end portion of the second substrate is disposed inside an end portion of the first substrate.
Claims4
A MEMS device comprising:
- a driving integrated circuit (IC);
- a first substrate;
- a second substrate that is disposed laminated on the first substrate;
- a functional element that is disposed between the first substrate and the second substrate, and
- a wiring that passes through the first substrate and connects the driving IC and the functional element;
- wherein:
- the second substrate is smaller than the first substrate,
- in planar view, an end portion of the second substrate is disposed inside an end portion of the first substrate with the first substrate being cantilevered relative to the end portion of the second substrate, and
- the first substrate is disposed between the driving IC and the functional element.
6 more elements
Dependencies are inferred from the claim text.