Solder composition and electronic board

A solder composition comprising:

• a flux composition comprising a component (A) in a form of a rosin-based resin, a component (B) in a form of an activator, a component (C) in a form of a solvent and a component (D) in a form of a thixotropic agent;
• and
• a component (E) in a form of a solder powder, wherein
• the component (C) in a form of the solvent comprises a component (C1) in a form of isobornyl cyclohexanol, a component (C2) in a form of a solvent whose viscosity at 20 degrees C. is 10 mPa·s or less and whose boiling point ranges from 220 degrees C. to 245 degrees C. and a component (C3) in a form of a solvent whose viscosity at 20 degrees C. is 10 mPa·s or less and whose boiling point ranges from 255 degrees C. to 300 degrees C.,
• the component (C2) is at least one selected from the group consisting of tripropyleneglycol monomethylether, dipropylene glycol monobutylether and ethyleneglycol mono-2-ethylhexyl ether,
• the component (C3) is at least one selected from the group consisting of diethyleneglycol mono-2-ethylhexyl ether, benzylglycol, diethyleneglycol monohexylether and tetraethylene glycol dimethyl ether,
• a mass ratio ((C2)/(C1)) of the component (C2) to the component (C1) is in a range from 1/2 to 1, and
• a mass ratio ((C3)/(C1)) of the component (C3) to the component (C1) is in a range from 1/2 to 2.