Interface structures and methods for forming same
AssigneeInvensas Bonding Technologies, Inc.
InventorsShaowu Huang, Javier DeLaCruz
Life of this patent
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Abstract
A stacked and electrically interconnected structure is disclosed. The stacked structure can include a first element comprising a first contact pad and a second element comprising a second contact pad. The first contact pad and the second contact pad can be electrically and mechanically connected to one another by an interface structure. The interface structure can comprise a passive equalization circuit that includes a resistive electrical pathway between the first contact pad and the second contact pad and a capacitive electrical pathway between the first contact pad and the second contact pad. The resistive electrical pathway and the capacitive electrical pathway form an equivalent parallel resistor-capacitor (RC) equalization circuit.
Claims28
A stacked and electrically interconnected structure comprising:
- a first element comprising a first contact pad;
- and
- a second element comprising a second contact pad, the first element and the second element directly bonded to one another without an intervening adhesive,
- the first contact pad and the second contact pad being electrically and mechanically connected to one another by an interface structure, the interface structure disposed between a lower surface of the first contact pad and an upper surface of the second contact pad, the interface structure comprising a passive equalization circuit that includes a resistive electrical pathway between the first contact pad and the second contact pad and a capacitive electrical pathway between the first contact pad and the second contact pad, the capacitive electrical pathway comprising a dielectric feature between the first and second contact pads, the resistive electrical pathway at least partially embedded in the dielectric feature.
A method for forming a stacked and electrically interconnected structure, the method comprising:
- providing a first element comprising a first contact pad;
- providing a second element comprising a second contact pad;
- and
- directly bonding the first element to the second element along a bonding interface without an intervening adhesive to define an interface structure comprising a passive equalization circuit, the passive equalization circuit including a resistive electrical pathway between the first contact pad and the second contact pad and a capacitive electrical pathway between the first contact pad and the second contact pad, the capacitive electrical pathway comprising a dielectric feature between the first and second contact pads, the resistive electrical pathway at least partially embedded in the dielectric feature.
A stacked and electrically interconnected structure comprising:
- a first element;
- and
- a second element directly bonded to the first element along a bonding interface without an intervening adhesive,
- wherein one or more passive electronic components are integrally formed between a lower surface of the first element and an upper surface of the second elements along the bonding interface, the one or more passive electronic components extending across the bonding interface between the first and second elements.
Dependencies are inferred from the claim text.