Method for electrodeposition on a conductive particulate substrate
AssigneeBAE SYSTEMS plc
InventorsAmy Elizabeth Dyke, Michael Dunleavy
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Abstract
The present invention relates to a method of electrodepositing a metal on an electrically conductive particulate substrate. There is provided a method of electrodepositing a metal on an electrically conductive particulate substrate comprising the steps of: (i) providing a cathode; (ii) providing an anode formed from the metal to be electrodeposited; (iii) providing the substrate, cathode and anode within an electrodeposition bath comprising an electrolyte; and (iv) providing a voltage between said anode and cathode causing metal ions to flow from the anode to the cathode, wherein a separator is provided between the anode and the cathode.
Claims10
A method of electrodepositing a metal on an electrically conductive particulate substrate comprising the steps of:
- providing a cathode that is distinct from the particulate substrate;
- providing an anode formed from the metal to be electrodeposited;
- providing a separator between the anode and the cathode, the separator being a semipermeable membrane that is porous to an electrolyte and to the metal ions, but not to the particulate substrate, the separator being configured to maintain the particulate substrate within a substrate volume proximate to the cathode;
- providing the particulate substrate within the substrate volume at a concentration that is in a range of from 0.0001 vol % to 5 vol %, where vol % refers to a percentage of the substrate volume that is occupied by the particulate substrate;
- locating the substrate, cathode and anode within an electrodeposition bath comprising the electrolyte;
- and
- applying a voltage between said anode and cathode, thereby causing metal ions to flow from the anode to the cathode.
Dependencies are inferred from the claim text.