# US 10,442,035 B2 · Laser welding method

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- Number: US 10,442,035 B2
- Document ID: US10442035B2
- Status: Granted
- Kind: B2
- Application number: 15/181,988
- Filed: 2016-06-14
- Published: 2016-10-06
- Granted: 2019-10-15
- Earliest claimed: 2013-12-19
- Assignees: Fuji Electric Co., Ltd.
- Applicants: Fuji Electric Co., Ltd.
- Inventors: Yuta Tamai
- Web page: https://patentgrep.com/patent/US10442035B2

## CPC

- B23K 26/206: {Laser sealing}
- B23K 26/0006: {taking account of the properties of the material involved (B23K26/32, B23K26/40 take precedence)}
- B23K 26/037: {by pressing on the workpiece, e.g. using a pressing roller foot}
- B23K 26/0622: by shaping pulses
- B23K 26/211: with interposition of special material to facilitate connection of the parts
- B23K 26/22: Spot welding
- B23K 26/32: taking account of the properties of the material involved
- H10W 70/05: of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04)
- H10W 72/00: Interconnections or connectors in packages
- H10W 76/136: having other interconnections perpendicular to the conductive base
- H10W 99/00: Subject matter not provided for in other groups of this subclass
- B23K 2101/34: Coated articles {; Surface treated articles}
- B23K 2101/35: {Surface treated articles}
- B23K 2101/42: Printed circuits
- B23K 2103/08: Non-ferrous metals or alloys
- B23K 2103/10: Aluminium or alloys thereof
- B23K 2103/12: Copper or alloys thereof
- B23K 2103/16: Composite materials
- B23K 2103/172: {wherein at least one of the layers is non-metallic}
- B23K 2103/50: {Inorganic materials other than metals or composite materials}
- H10W 40/255: {having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates}
- H10W 72/07141: {Means for applying energy, e.g. ovens or lasers}
- H10W 72/07163: {Means for mechanical processing, e.g. for planarising, pressing, stamping or drilling}
- H10W 72/07331: {Connecting techniques}
- H10W 72/07335: {Applying EM radiation, e.g. induction heating or using a laser}
- H10W 72/07336: {Soldering or alloying}
- H10W 72/07354: {changes in dispositions}
- H10W 72/076: {of strap connectors}
- H10W 72/347: {Dispositions of multiple die-attach connectors}
- H10W 72/352: {comprising metals or metalloids, e.g. solders}
- H10W 72/622: {Multilayered strap connectors, e.g. having a coating on a lowermost surface of a core}
- H10W 72/646: {the connected ends being on auxiliary connecting means on bond pads, e.g. on a bump connector}
- H10W 72/652: {comprising metals or metalloids, e.g. silver}
- H10W 72/653: {not comprising solid metals or solid metalloids, e.g. polymers, ceramics or liquids}
- H10W 72/655: {of outermost layers of multilayered strap connectors, e.g. material of a coating}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 72/952: {comprising metals or metalloids, e.g. PbSn, Ag or Cu}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W 90/763: {between laterally-adjacent chips}
- B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A laser welding method using a laser welding jig having a plurality of pressing parts, includes a step of placing a second member on a first member; a step of pressing the second member with the plurality of pressing parts in a direction toward the first member to thereby form a gap between the first member and the second member at most 300 μm; and a first welding step of laser-welding the first member and the second member by irradiating on a surface of the second member at a location between the pressing parts with laser light while conducting the step of pressing.

## Claims

### Claim 1

A laser welding method using a laser welding jig having a plurality of pressing parts, comprising:
a step of placing a second member on a first member;
a step of pressing the second member with the plurality of pressing parts in a direction toward the first member to thereby form a gap between the first member and the second member at most 300 μm, the plurality of pressing parts being a pair of claws with an interval therebetween;
a first welding step of laser-welding the first member and the second member by irradiating on a surface of the second member through the interval between the pair of claws with laser light while conducting the step of pressing; and
a second welding step of laser-welding the first member and the second member by irradiating on the surface of the second member with the laser light while the pair of claws does not press the second member toward the first member.

### Claim 2 (depends on 1)

The laser welding method according to claim 1, further comprising:
a step of preparing a semiconductor device that comprises a ceramic insulated substrate, a front surface conductor pattern fixed on a front surface of the ceramic insulated substrate, a semiconductor chip electrically connected to the front surface conductor pattern, the first member electrically connected to the semiconductor chip, and the second member laser-welded to the first member at at least one portion to electrically connect thereto, and
a step of sealing the ceramic insulated substrate, the front surface conductor pattern, the semiconductor chip, and a part of the first member with a sealing material before the step of placing the second member on the first member.

### Claim 3

A laser welding method using a laser welding jig having a plurality of pressing parts, comprising
a step of placing a second member on a first member;
a step of inserting a spacer between the first and second members so that a gap between the first and second members is more than 0 μm and at most 300 μm,
a step of pressing the second member with the plurality of pressing parts in a direction toward the first member to thereby form the gap between the first member and the second member at most 300 μm, the plurality of pressing parts being a pair of claws with an interval therebetween; and
a first welding step of laser-welding the first member and the second member by irradiating on a surface of the second member through the interval between the pair of claws with laser light while conducting the step of pressing,
wherein in the first welding step, the laser is irradiated on the surface of the second member above the gap where the spacer is not inserted, to melt the first and second members and form a welded part, and a melted part of the first and second members enters into the gap to expand the welded part in a direction perpendicular to the direction toward the first member for increasing a shear strength of the welded part.

### Claim 4 (depends on 3)

The laser welding method according to claim 3, further comprising a second welding step of laser-welding the first member and the second member at a region with a gap between the first member and the second member of at most 300 μm after the first welding step.

### Claim 5 (depends on 4)

The laser welding method according to claim 4, wherein a distance between centers of welding portions at the first and second welding steps is at most 4 mm.

### Claim 6 (depends on 4)

The laser welding method according to claim 4, further comprising a step of forming engaging parts on the first member and the second member, for positioning the first member and the second member,
wherein a portion of laser welding is different from the engaging parts.