# US 10,442,034 B2 · Wafer cutting apparatus > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,442,034 B2 - Document ID: US10442034B2 - Status: Granted - Kind: B2 - Application number: 15/281,578 - Filed: 2016-09-30 - Published: 2017-07-27 - Granted: 2019-10-15 - Earliest claimed: 2016-01-21 - Assignees: Samsung Electronics Co., Ltd. - Applicants: Samsung Electronics Co., Ltd. - Inventors: Kyoung Whan Oh; Yeon Woo Choi; In Hwan Kim; Won Ki Park; Ho Youl Lee; Yong Won Choi - Web page: https://patentgrep.com/patent/US10442034B2 ## CPC - B23K 26/0876: {in at least two axial directions} - B23K 26/03: Observing, e.g. monitoring, the workpiece - B23K 26/032: {using optical means} - B23K 26/38: by boring or cutting - B23K 26/402: involving non-metallic material, e.g. isolators - H10P 54/00: Cutting or separating of wafers, substrates or parts of devices - H10P 72/0428: {Apparatus for mechanical treatment or grinding or cutting} - H10P 72/0606: {Position monitoring, e.g. misposition detection or presence detection} - B23K 2101/40: Semiconductor devices - B23K 2103/56: {being semiconducting} - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract A wafer cutting apparatus includes a stage to support a wafer, a cutter, and a sensor. The cutter irradiates the wafer with a beam in a first direction to cut the wafer. The sensor is spaced apart from the cutter in a second direction different from the first direction, and measures a spaced distance between the wafer and the cutter. The sensor measures the spaced distance between the wafer and the cutter along a second cutting line parallel to a first cutting line while the cutter cuts the wafer along the first cutting line on the wafer. ## Claims ### Claim 1 A wafer cutting apparatus, comprising: a stage to support a wafer; a cutter to cut the wafer in a first direction using a beam; a sensor spaced being apart from the cutter in a second direction different from the first direction and being independently movable from the cutter in the second direction, the sensor to measure a spaced distance between the wafer and the cutter; and a third mover to move the cutter in a third direction perpendicular to the first and second directions to adjust a cutting depth of the wafer, wherein the sensor is to measure the spaced distance between the wafer and the cutter along a second cutting line parallel to a first cutting line while the cutter cuts the wafer along the first cutting line on the wafer. ### Claim 2 (depends on 1) The apparatus as claimed in claim 1, wherein the sensor is adjusted such that an interval in the second direction, perpendicular to the first direction between the cutter and the sensor, is equal to an interval between the first cutting line and the second cutting line. ### Claim 3 (depends on 2) The apparatus as claimed in claim 2, further comprising: a first mover to move the sensor and cutter in the first direction, and a second mover to move the sensor and the cutter in the second direction. ### Claim 4 (depends on 3) The apparatus as claimed in claim 3, wherein after cutting of the wafer is completed along the first cutting line: the second mover is to move the cutter to a first end of the second cutting line, and is to move the sensor to a first end of a third cutting line parallel to the second cutting line. ### Claim 5 (depends on 1) The apparatus as claimed in claim 1, further comprising: an adjuster to adjust an interval in the second direction between the sensor and the cutter, in order to adjust an interval between the first cutting line and the second cutting line. ### Claim 6 (depends on 5) The apparatus as claimed in claim 5, further comprising: a calculator to calculate a position of a third cutting line parallel to the second cutting line by extrapolation based on the interval between the first cutting line and the second cutting line. ### Claim 7 (depends on 1) The apparatus as claimed in claim 1, further comprising: a calculator to calculate a position of the second cutting line between the first cutting line and a third cutting line by interpolation based on an interval between the first cutting line and the third cutting line parallel to the first cutting line. ### Claim 8 (depends on 7) The apparatus as claimed in claim 7, wherein the calculator is to calculate positions of the second and third cutting lines based on a combination of the interpolation and extrapolation for calculating the position of the third cutting line based on the interval between the first cutting line and the second cutting line. ### Claim 9 (depends on 1) The apparatus as claimed in claim 1, wherein the cutter is moved in the third direction independently from the sensor. ### Claim 10 (depends on 1) The apparatus as claimed in claim 1, wherein the cutter is a laser cutter. ### Claim 11 A wafer cutting apparatus, comprising: a stage to support a wafer; a cutter to irradiate the wafer with a beam along a first direction to cut the wafer; a first sensor on a first side of the cutter to measure a first spaced distance between the wafer and the cutter; a second sensor, on a second side opposing the first side of the cutter, to measure a second spaced distance between the wafer and the cutter; and a corrector to correct an offset between the first sensor and the second sensor based on a comparison of the measured first spaced distance and the measured second spaced distance, wherein the cutter, the first sensor, and the second sensor are disposed along the first direction, and wherein at least one of the first or second sensors are to operate while the cutter cuts the wafer. ### Claim 12 (depends on 11) The apparatus as claimed in claim 11, wherein after cutting of the wafer is completed along a first cutting line formed on the wafer: the cutter, the first sensor, and the second sensor are to be moved to one end of the wafer which includes a second cutting line parallel to the first cutting line. ### Claim 13 (depends on 11) The apparatus as claimed in claim 11, further comprising: a first mover to move the first and second sensors and the cutter on a plane parallel to the wafer; and a second mover to move the cutter in a direction perpendicular to the wafer to adjust a cutting depth of the wafer. ### Claim 14 (depends on 11) The apparatus as claimed in claim 11, wherein: the cutter cuts the wafer when the cutter is advanced in the first direction, while the first sensor measures the first spaced distance, and when the cutter is advanced in a second direction opposite to the first direction, the cutter cuts the wafer while the second sensor measures the second spaced distance. ### Claim 15 (depends on 11) The apparatus as claimed in claim 11, wherein the cutter is a laser cutter.