Carrier tape, method for manufacturing same, and method for manufacturing RFID tag

A carrier tape housing a plurality of electronic components with seal materials, the carrier tape comprising:

• a tape-shaped main body including a first principal surface and a second principal surface and including a plurality of housing holes penetrating from the first principal surface to the second principal surface along a longitudinal direction;
• a plurality of seal materials each having an adhesive layer on one principle surface and affixed to the second principal surface of the tape-shaped main body such that the adhesive layer is exposed in at least a portion of each of the housing holes;
• and
• a plurality of chip-shaped electronic components housed in the respective housing holes and fixed to the adhesive layers of the respective seal materials;
• wherein
• the electronic components are components defining RFID tags and each includes an RFIC chip and a substrate with the RFIC chip mounted thereon;
• and
• the substrate is a substrate of an RFID tag and includes a power feeding circuit that performs impedance matching between an antenna element and the RFIC chip.