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US 10,433,469 B1Granted
Semiconductor package and semiconductor module
AssigneeSamsung Electronics Co., Ltd.
InventorJoungphil Lee
Life of this patent
Estimating the term…
Abstract
A semiconductor package including a package substrate including a ground layer, a first segment of which is exposed to outside the package substrate, a semiconductor chip on the package substrate, and a functional layer including a conductive polymer and an adhesive polymer, covering the semiconductor chip, and being in contact with the first segment of the ground layer may be provided.
Claims17
A semiconductor package comprising:
- a package substrate including an insulating layer and a ground layer, the ground layer longitudinally extending in the insulating layer, an end portion of the ground layer exposed by the insulating layer;
- a semiconductor chip on the package substrate;
- a molding layer on the package substrate and surrounding at least a side surface of the semiconductor chip;
- and
- an electromagnetic shield layer covering the molding layer and the semiconductor chip, an end portion of the electromagnetic shield layer running in parallel with and being in contact with the end portion of the ground layer, the electromagnetic shield layer including a first lateral portion and a second lateral portion, the first lateral portion facing the side surface of the semiconductor chip, the second lateral portion at an end of the electromagnetic shield layer and horizontally spaced apart from the first lateral portion, the second lateral portion of the electromagnetic shield layer and a lateral end surface of the ground layer being on a substantially straight line and exposed to outside of the package substrate,
- wherein the electromagnetic shield layer includes a conductive polymer and an adhesive polymer.
3 more elements
A semiconductor package comprising:
- a package substrate including an insulating layer and a ground layer, the ground layer longitudinally extending in the insulating layer, an end portion of the ground layer exposed by the insulating layer;
- a semiconductor chip on the package substrate;
- a molding dam extending upward from a top surface of the package substrate, the molding dam horizontally spaced apart from the semiconductor chip,
- a window layer supported by the molding dam, the window layer and the molding dam enclosing the semiconductor chip on the package substrate, the window layer being transparent;
- and
- an electromagnetic shield layer covering the molding dam and the window layer, the electromagnetic shield layer including an end portion that runs in parallel with and is in contact with the exposed end portion of the ground layer, the electromagnetic shield layer including a first lateral portion and a second lateral portion, the first lateral portion facing a side surface of the semiconductor chip, the second lateral portion at an end of the electromagnetic shield layer and horizontally spaced apart from the first lateral portion, the second lateral portion of the electromagnetic shield layer and a lateral end surface of the ground layer being on a substantially straight line and exposed to outside of the package substrate.
3 more elements
Dependencies are inferred from the claim text.