Thermal dissipation system for wearable electronic devices

A wearable device comprising:

• a housing that includes a heat source;
• a thermal conduit having at least a first segment that is positioned to absorb heat emitted by the heat source and a second segment to transfer at least a portion of the heat that is emitted from the heat source away from the housing;
• at least one support structure that is coupled to the housing and that at least partially encloses the second segment of the thermal conduit within a plurality of regions that have varying properties that result in a plurality of thermal resistances between the thermal conduit and an ambient environment, wherein the varying properties include at least one of:
• varying thermal conductivities across at least some of the plurality of regions, or varying material thicknesses across at least some of the plurality of regions.

A head-mounted display device comprising:

• a display assembly at least partially enclosing one or more electronic components that emit heat during operation, wherein the display assembly includes a display component to generate images in front of an eye of a user;
• at least one support assembly that is coupled to the display assembly and that is configured to mount the display assembly to a head of the user, wherein the at least one support assembly comprises a first region that includes a first material having a first thermal conductivity and a second region that includes a second material having a second thermal conductivity, wherein the first region is closer to the one or more electronic components than the second region;
• and
• a thermal conduit that is positioned to absorb the heat emitted by the one or more electronic components and to transfer at least some of the heat through the first region to the second region, wherein the first thermal conductivity results in the first region having a first thermal resistance from the thermal conduit to an ambient environment, and wherein the second thermal conductivity results in the second region having a second thermal resistance, from the thermal conduit to the ambient environment, that is less than the first thermal resistance.