Chassis external wall cooling system

An information handling system (IHS), comprising:

• a chassis that defines a chassis space;
• a processing system that is located in the chassis space;
• a memory system that is located in the chassis space and that is coupled to the processing system;
• a chassis wall that is provided on the chassis and that includes:
• a first surface that is located adjacent at least a portion of the chassis space;
• a second surface that is located opposite the chassis wall from the first surface and that provides at least a portion of an external surface of the chassis;
• a plurality of heat transfer members that extend from the chassis wall to provide at least a portion of the external surface, wherein each of the plurality of heat transfer members defines a coolant cavity;
• and
• a cooling channel that is defined by the chassis wall between the first surface and the plurality of heat transfer members and configured to couple to an adjacent cooling channel of an adjacent chassis wall that extends from the chassis wall, wherein the cooling channel is configured to channel a coolant through at least a portion of the chassis wall and through the coolant cavity defined by each of the plurality of heat transfer members;
• and
• a liquid moving system that is located within the chassis wall between the first surface and the second surface, that is coupled to the cooling channel, and that is configured to move the coolant through the cooling channel.

A method for providing liquid cooling using an external chassis wall, comprising:

• operating at least one heat producing component that is located in a chassis, wherein a chassis wall is provided on the chassis and includes:
• a first surface that is located adjacent at least a portion of a chassis space defined by the chassis;
• and
• a second surface that is located opposite the chassis wall from the first surface and that provides at least a portion of an external surface of the chassis;
• a plurality of heat transfer members that extend from the chassis wall to provide at least a portion of the external surface;
• and
• moving a coolant through a serpentine coolant channel that is routed within the chassis wall between the first surface and the second surface and that is configured to couple to an adjacent cooling channel of an adjacent chassis wall that extends from the chassis wall, wherein the coolant is moved by a liquid moving system that is located within the chassis wall between the first surface and the second surface and that is coupled to the serpentine cooling channel;
• and
• transferring heat produced by the operation of the least one heat producing component out of the chassis using the coolant.