Electronic device including thin housing, and manufacturing method therefor

A mobile electronic device comprising:

• a housing including at least a first side wall, a second side wall located along opposite side of the first side wall, the housing forming at least part of a rear surface of the mobile electronic device, at least part of the housing formed of metallic material;
• and
• a display coupled to the housing,
• wherein a first jig hanger part used by an anodizing process is formed on an inner surface of the first side wall and a second jig hanger part used by the anodizing process is formed on an inner surface of the second side wall,
• wherein a first recess including a first area in which an anodizing layer is formed on the metallic material, and a second area, located adjacent to the first area, in which the metallic material is exposed,
• wherein a second recess including a first area in which an anodizing layer is formed on the metallic material,
• wherein at least a portion of the first recess corresponds to the first jig hanger part and at least a portion of the second recess corresponds to the second jig hanger part, and
• wherein at least one of the first recess or the second recess is configured to accept at least a portion of a jig during the anodizing process.

An electronic device comprising:

• a housing including at least a first side wall, a second side wall located along opposite side of the first side wall, the housing forming at least part of a rear surface of the electronic device, at least part of the housing formed of metallic material;
• and
• a display coupled to the housing,
• wherein a first recess is formed on an inner surface of the first side wall and a second recess is formed on an inner surface of the second side wall, each of the first and second recesses including a first area in which an anodizing layer is formed on the metallic material, and a second area, located adjacent to the first area, in which the metallic material is exposed for connecting a jig during an anodizing process, and a conductive area is formed on the second area and at least a portion of the first area after the anodizing process, and
• wherein at least one of the first recess or the second recess is configured to accept at least a portion of the jig during the anodizing process.

A mobile electronic device comprising:

• a housing comprising a first side wall and a second side wall located on an opposite side of the first side wall, the housing forming at least part of a rear surface of the mobile electronic device, at least part of the housing being formed of a metallic material;
• and
• a display coupled to the housing,
• wherein a first recess is formed on an inner surface of the first side wall, and wherein the first recess includes a first area, in which an anodizing layer is formed on the metallic material, and a second area, which is located adjacent to the first area, in which the metallic material is exposed,
• wherein a second recess is formed on an inner surface of the second side wall, the second recess includes an area in which an anodizing layer is formed on the metallic material, and
• wherein at least one of the first recess or the second recess is configured to accept at least a portion of a jig during an anodizing process.