Wiring substrate for electronic component inspection apparatus
AssigneeNgk Spark Plug Co., Ltd.
InventorTakakuni Nasu
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Abstract
A wiring substrate for electronic component inspection apparatus includes a first laminate which is formed by stacking a plurality of ceramic layers and which has a front surface and a back surface, and a plurality of studs joined to the back surface of the first laminate, wherein each of the studs is composed of a flange portion which is circular in bottom view, and a bolt portion which perpendicularly extends from a center portion of an outside surface of the flange portion; and in a vertical cross section along an axial direction of the bolt portion, the outside surface from which the bolt portion protrudes has a curved surface which is convex toward an inside surface of the flange portion facing the back surface of the first laminate.
Claims6
A wiring substrate for electronic component inspection apparatus comprising a first laminate which is formed by stacking a plurality of ceramic layers and which has a front surface and a back surface, and a plurality of studs joined to the back surface of the first laminate,
- the wiring substrate for electronic component inspection apparatus being characterized in that
- each of the studs is composed of a flange portion which is circular in bottom view, and a bolt portion or a nut tube portion which perpendicularly extends from a center portion of the flange portion;
- and
- in a vertical cross section of the flange portion along an axial direction of the bolt portion or the nut tube portion, an outside surface of the flange portion from which the bolt portion or the nut tube portion protrudes is defined by a curve which is convex toward an inside surface of the flange portion facing the back surface of the first laminate.
Dependencies are inferred from the claim text.