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US 10,433,428 B2Granted
Application specific electronics packaging systems, methods and devices
AssigneeMolex Incorporated
InventorsMarko Spiegel, Victor Zaderej, Amrit Panda
Life of this patent
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Abstract
Depicted embodiments are directed to an Application Specific Electronics Packaging (“ASEP”) system, which enables the manufacture of additional products using reel to reel (68a, 68b) manufacturing processes as opposed to the “batch” processes used to currently manufacture electronic products and MIDs. Through certain ASEP embodiments, it is possible to integrate connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memory, impedance control, and multi-layer functionality directly into a product.
Claims14
A light comprising:
- a housing;
- a light pipe attached to the housing;
- and a device formed by an Application Specific Electronics Packaging System mounted in the housing, the Application Specific Electronics Packaging System having at least one light emitting diode provided thereon, the light pipe being positioned above the at least one light emitting diode, wherein forming the Application Specific Electronics Packaging System comprises:
- forming a continuous carrier;
- molding a plurality of substrates onto the carrier;
- forming traces on the substrates;
- electroplating the traces;
- electrically attaching components to the traces to form a plurality of devices, at least one of the components on each device being a light emitting diode;
- singulating one of the devices from the remainder of the carrier, and wherein the components are seated within pockets formed in the substrates.
6 more elements
A device comprising:
- a singulated carrier portion;
- a substrate molded onto the singulated carrier portion;
- seed layer traces on the substrate;
- plated metal traces on the seed layer traces;
- and a component electrically attached to at least one plated metal trace, wherein the component is seated within a pocket formed in the substrate, and wherein the pocket is formed into the substrate such that a portion of the singulated carrier portion is exposed.
2 more elements
A device comprising:
- a singulated carrier portion;
- a substrate molded onto the singulated carrier portion;
- conductive material deposited on the substrate having electrically isolated portions formed therein;
- a component electrically attached to at least one electrically isolated portion of the material, wherein the component is seated within a pocket formed in the substrate, and wherein the pocket is formed into the substrate such that a portion of the singulated carrier portion is exposed.
1 more element
Dependencies are inferred from the claim text.