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US 10,433,426 B2Granted
Circuit board and method for manufacturing the same
AssigneeUnimicron Technology Corp.
InventorPo-Hsuan Liao
Life of this patent
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Abstract
A circuit board includes a substrate, a first dielectric layer, an adhesive layer, a second dielectric layer, and a first conductive line. The first dielectric layer is disposed on the substrate. The adhesive layer is bonded to the first dielectric layer and has a top surface opposite to the substrate. The second dielectric layer is disposed on the adhesive layer and has at least one first through hole. The first conductive line is located in the first through hole of the second dielectric layer and is in contact with the top surface of the adhesive layer.
Claims3
A circuit board, comprising:
- a substrate;
- a first dielectric layer disposed on the substrate;
- an adhesive layer bonded to the first dielectric layer and having a top surface opposite to the substrate;
- a second dielectric layer disposed on the adhesive layer and having at least one first through hole;
- a first conductive line located in the first through hole of the second dielectric layer, wherein a lowermost surface of the first conductive line is in contact with the top surface of the adhesive layer and the first conductive line is above an entirety of the adhesive layer;
- and
- a plurality of second conductive lines penetrating through the adhesive layer and the second dielectric layer and being in contact with the first dielectric layer, wherein the first conductive line is located between adjacent two of the second conductive lines.
4 more elements
Dependencies are inferred from the claim text.