Three-dimensional high quality passive structure with conductive pillar technology
AssigneeQUALCOMM Incorporated
InventorsKai Liu, Changhan Hobie Yun, Jonghae Kim, Mario Francisco Velez
Life of this patent
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Abstract
A passive structure using conductive pillar technology instead of through via technology includes a substrate having a first redistribution layer (RDL) and a three-dimensional (3D) integrated passive device on the substrate. The passive structure includes multiple pillars on the substrate where each of the pillars is taller than the 3D integrated passive device. The passive structure further includes a molding compound on the substrate surrounding the 3D integrated passive device and the pillars. Furthermore, the passive structure includes multiple external interconnects coupled to the first RDL through the pillars.
Claims16
A device, comprising:
- a substrate including a first RDL (first redistribution layer);
- a 3D integrated passive device (three-dimensional integrated passive device) on the substrate;
- a plurality of pillars on the substrate, each of the plurality of pillars taller than the 3D integrated passive device;
- a molding compound on the substrate and surrounding the 3D integrated passive device and the plurality of pillars;
- and
- a plurality of external interconnects coupled to the first RDL through the plurality of pillars, the 3D integrated passive device coupled to the plurality of external interconnects via the first RDL and the plurality of pillars.
A method of fabricating an electronic device, the method comprising:
- forming a substrate including a first RDL (first redistribution layer);
- forming a three-dimensional (3D) integrated passive device on the substrate;
- forming a plurality of pillars on the substrate, each of the plurality of pillars taller than the 3D integrated passive device;
- depositing a molding compound on the substrate, the molding compound surrounding the 3D integrated passive device and the plurality of pillars;
- and
- forming a plurality of external interconnects coupled to the first RDL through the plurality of pillars, the 3D integrated passive device coupled to the plurality of external interconnects via the first RDL and the plurality of pillars.
A radio frequency (RF) front end module comprising:
- a device having a substrate including a first RDL (first redistribution layer), a 3D integrated passive device (three-dimensional integrated passive device) on the substrate, a plurality of pillars on the substrate, each of the plurality of pillars taller than the 3D integrated passive device, a molding compound on the substrate and surrounding the 3D integrated passive device and the plurality of pillars, and a plurality of external interconnects coupled to the first RDL through the plurality of pillars, the 3D integrated passive device coupled to the plurality of external interconnects via the first RDL and the plurality of pillars;
- and
- an antenna coupled to the device.
Dependencies are inferred from the claim text.