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US 10,433,424 B2Granted
Electronic module and the fabrication method thereof
AssigneeCyntec Co., Ltd.
InventorsChun-Tiao Liu, Bau-Ru Lu
Life of this patent
Estimating the term…
Abstract
An electronic module is disclosed. The electronic module includes a substrate, a plurality of electronic components electrically connected to a first side of the substrate, and another plurality of electronic components embedded in the substrate. In some other embodiments, the electronic module further comprises a heat sink disposed on at least one of the plurality of electronic components to dissipate the heat generated by the at least one of the plurality of electronic components. And, in some other embodiment, the electronic module further comprises a molding body disposed on the plurality of electronic components and, in further embodiments, the heat sink.
Claims13
An electronic module, comprising:
- a unitary substrate, having a top surface and a bottom surface, wherein the unitary substrate is made of a single insulating layer extending from the top surface to the bottom surface of the unitary substrate, wherein there is no horizontally-placed conductive layer that is disposed between said top surface and said bottom surface of the unitary substrate, wherein a conductive layer is disposed on the top surface of the unitary substrate;
- a plurality of first discrete electronic components, embedded inside the unitary substrate and electrically connected to the conductive layer, wherein a top surface of each of the plurality of first discrete electronic components is respectively located lower than the top surface of the unitary substrate, and a bottom surface of each of the plurality of first discrete electronic components is respectively located higher than the bottom surface of the unitary substrate;
- a second discrete inductor, comprising a magnetic body and a coil encapsulated in the magnetic body, wherein the magnetic body is disposed over the top surface of the unitary substrate;
- and
- a molding body, disposed over the top surface of the unitary substrate and the plurality of first discrete electronic components to encapsulate the magnetic body of the second discrete inductor, wherein the second discrete inductor embedded in the molding body is electrically connected to a discrete electronic component of the plurality of first discrete electronic components via the conductive layer disposed on the top surface of the unitary substrate and a conductive via that is entirely disposed inside the unitary substrate.
2 more elements
An electronic module, comprising:
- a unitary substrate, having a top surface and a bottom surface, wherein the unitary substrate is made of a single insulating layer extending from the top surface to the bottom surface of the unitary substrate, wherein there is no horizontally-placed conductive layer that is disposed between said top surface and said bottom surface of the unitary substrate, wherein a conductive layer is disposed on the top surface of the unitary substrate, and a recess is formed in the unitary substrate;
- a plurality of first electronic components embedded inside the unitary substrate and electrically connected to the conductive layer, wherein a top surface of each of the plurality of first electronic components is respectively located lower than the top surface of the unitary substrate, and a bottom surface of each of the plurality of first electronic components is respectively located higher than the bottom surface of the unitary substrate;
- a second electronic component, disposed over the top surface of the unitary substrate, wherein the second electronic component is electrically connected to an electronic component of the plurality of first electronic components via said conductive layer disposed on the top surface of the unitary substrate and a conductive via that is entirely disposed inside the unitary substrate;
- and
- a third electronic component, comprising a plurality of electrodes disposed on a bottom surface of the third electronic component, wherein the third electronic component is disposed in the recess and the plurality of electrodes are exposed through the bottom surface of the unitary substrate for connecting with an external circuit.
2 more elements
An electronic device, comprising:
- an inductor having a body, wherein a recess is formed on a bottom surface of the body;
- and
- a heatsink, disposed on the body of the inductor, wherein said heatsink comprises a first part disposed on a top surface of the body of the inductor, a second part extended from the first part and disposed on a lateral surface of the body of the inductor, and a third part extended from the second part and disposed in said recess, wherein said third part is disposed directly on the bottom surface of the body of the inductor, wherein at least one portion of the third part is in contact with and electrically connected to a ground electrode on a substrate.
Dependencies are inferred from the claim text.