Method for manufacturing circuit board, and circuit board
AssigneeSumitomo Wiring Systems, Ltd.
InventorTsuyoshi Sakita
Life of this patent
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Abstract
A method of this invention is for manufacturing a circuit board in which terminal fittings and electronic components are provided on a first surface of a main substrate that has the first surface and a second surface, a sub substrate that has a first surface and a second surface is arranged on the second surface side of the main substrate, and the sub substrate and the main substrate are connected by relay terminals. The main substrate and the sub substrate are formed in advance in a state of being connected in the same plane. During the method, the main and sub substrate are initially physical connected, at which time electrical components are attached to at least the main substrate. After physically separating the main and sub substrates, they are electrically connected.
Claims6
A circuit board in which a main substrate has a first surface and a second surface, a terminal fitting and an electronic component are soldered to the first surface, a sub substrate has a first surface and a second surface and is arranged on a second surface side of the main substrate with a predetermined gap therebetween, two ends of a relay terminal are respectively soldered to and span between the first surface of the sub substrate and the second surface of the main substrate, and a separated surface is formed at a predetermined side edge of the main substrate and a predetermined side edge of the sub substrate, wherein the separated surface is a surface formed by disconnecting the main substrate and the sub substrate from a state of being physically connected in the same plane.
A method for manufacturing a circuit board in which a terminal fitting and an electronic component are provided on a first surface of a main substrate that has the first surface and a second surface, a sub substrate that has a first surface and a second surface is arranged on a second surface side of the main substrate, and the sub substrate and the main substrate are connected by a relay terminal,
- wherein the main substrate and the sub substrate are formed in advance in a state of being physically connected in the same plane, and
- the method comprises the following steps that are executed sequentially:
- a first soldering step of soldering the terminal fitting and the electronic component to the first surface of the main substrate, and soldering a base end of the relay terminal to the first surface of the sub substrate;
- a separating step of separating the main substrate and the sub substrate;
- and
- a second soldering step of arranging the sub substrate on the second surface side of the main substrate, and soldering a leading end of the relay terminal to the second surface of the main substrate.
Dependencies are inferred from the claim text.