Circuit board device and printed wiring board

A printed wiring board comprising:

• a primary layer which has a first region on which an IC chip is mounted and a second region adjacent to the first region;
• a first wiring which is provided 1in the second region of the primary layer of the printed wiring board;
• a second wiring which is provided in the second region of the primary layer and is placed at a distance from the first wiring and is supplied with a power supply potential;
• a third wiring which is provided in the second region of the primary layer and is placed at a distance from the first wiring and the second wiring;
• a first via which passes through the primary layer to be connected to the first wiring;
• a second via which passes through the primary layer of the printed wiring board to be connected to the second wiring and the third wiring;
• and
• a ground layer which is provided on an opposite side of the first wiring, the second wiring and the third wiring with respect to the primary layer and is electrically connected to the first wiring, the second wiring and the third wiring through the first via and the second via.

A circuit board device comprising:

• a printed wiring board including
• a primary layer which has a first region on which an IC chip is mounted and a second region adjacent to the first region;
• a first wiring which is provided across the first region and the second region of the primary layer of the printed wiring board;
• a second wiring which is provided in the second region of the primary layer of the printed wiring board;
• a first via which passes through the primary layer of the printed wiring board to be connected to the first wiring of the first region;
• a second via which passes through the primary layer of the printed wiring board to be connected to the second wiring;
• and
• a ground layer which is provided on an opposite side of the first wiring and the second wiring with respect to the primary layer and is electrically connected to the first wiring and the second wiring through the first via and the second via;
• and
• an IC chip which is mounted on the first region of the printed wiring board and has a ground terminal connected to the first wiring and a power supply terminal connected to the second wiring.

A circuit board device comprising:

• a printed wiring board including
• a primary layer which has a first region on which an IC chip is mounted and a second region adjacent to the first region;
• a first wiring which is provided 1in the second region of the primary layer of the printed wiring board;
• a second wiring which is provided in the second region of the primary layer and is placed at a distance from the first wiring and is supplied with a power supply potential;
• a third wiring which is provided in the second region of the primary layer and is placed at a distance from the first wiring and the second wiring;
• a first via which passes through the primary layer to be connected to the first wiring;
• a second via which passes through the primary layer of the printed wiring board to be connected to the second wiring and the third wiring;
• and
• a ground layer which is provided on an opposite side of the first wiring, the second wiring and the third wiring with respect to the primary layer and is electrically connected to the first wiring, the second wiring and the third wiring through the first via and the second via;
• and
• an IC chip which is mounted on the first region of the printed wiring board and has a ground terminal connected to the first wiring and a power supply terminal connected to the second wiring.