Computer circuit board cooling arrangement
AssigneePrimeKey Solutions AB
InventorsRoland Bramm, Manuel Dejonghe, Martin Oczko
Life of this patent
Estimating the term…
Abstract
A security arrangement (10) is adapted to improve heat dissipation from circuit board components (12, 14, 16, 18, 20) on a computer circuit board (22), where a plurality of the circuit components (12, 14, 16, 18, 20) are embedded in a security shield (5) and thermally connected to at least one heat exchanger device (24). The heat exchanger device (24) is located at a distance from the security shield (5), and at least a plurality of the circuit components (12, 14, 16, 18, 20) are thermally connected with said at least one heat exchanger device (24) via at least one heat dissipating lead (32, 33, 34) to enhance cooling of the circuit board components (12, 14, 16, 18, 20).
Claims16
A security arrangement (10) adapted to improve heat dissipation from circuit board components (12, 14, 16, 18, 20) on a computer circuit board (22), wherein a plurality of said circuit components (12, 14, 16, 18, 20) are embedded in a security shield (5) formed by a potting on at least one surface of said circuit board (22) and thermally connected to at least one heat exchanger device (24), wherein said heat exchanger device (24) is located at a distance from said security shield (5), and that at least a plurality of said circuit components (12, 14, 16, 18, 20) are thermally connected with said at least one heat exchanger device (24) via at least one heat dissipating lead (32, 33, 34) to enhance cooling of said circuit board components (12, 14, 16, 18, 20), wherein said at least one heat dissipating lead (32, 33, 34) is formed as an elongated heat transferring member, having at least one part attached within said security shield (5) and another part thermally connected to said heat exchanger, wherein the at least one heat dissipating lead extends from within the potting to out of the potting.
A method for providing a security arrangement (10) adapted to improve heat dissipation from circuit board components (12, 14, 16, 18, 20) on a computer circuit board (22), comprising embedding a plurality of said circuit components (12, 14, 16, 18, 20) in a security shield (5) formed by a potting having inherent low thermal conductivity on at least one surface of said circuit board (22) and thermally connecting said circuit components (12, 14, 16, 18, 20) to at least one heat exchanger device (24), by locating said heat exchanger device (24) at a distance from said security shield (5), and thermally connecting at least a plurality of said circuit components (12, 14, 16, 18, 20) with said at least one heat exchanger device (24) via at least one heat dissipating lead (32, 33, 34) to enhance cooling of said secured circuit board components (12, 14, 16, 18, 20), and wherein said at least one heat dissipating lead (32, 33, 34) is formed as an elongated heat transferring member, having at least one part attached within said security shield (5) and another part thermally connected to said heat exchanger, wherein the at least one heat dissipating lead extends from within the potting to out of the potting.
Dependencies are inferred from the claim text.