Back to results
US 10,433,415 B2Granted
Component carrier comprising a copper filled mechanical drilled multiple-diameter bore
AssigneeAT&S (China) Co. Ltd.
InventorsSally Sun, Yee-Bing Ling, Nikolaus Bauer-Öppinger, Wilhelm Tamm
Life of this patent
Estimating the term…
Abstract
A component carrier includes a layer stack formed of an electrically insulating structure and an electrically conductive structure with a bore extending into the layer stack. The bore includes a first bore section with a first diameter and a connected second bore section with a second diameter differing from the first diameter. The component carrier further comprises a thermally conductive material filling substantially the entire bore. The bore is in particular formed by mechanical drilling.
Claims12
A component carrier, comprising:
- a layer stack formed of an electrically insulating structure and an electrically conductive structure;
- a bore extending into the layer stack and having a first bore section with a first diameter and a connected second bore section with a second diameter differing from the first diameter;
- and
- a thermally conductive material filling substantially the entire bore,
- wherein, along the bore extending into the layer stack, the first diameter of the first bore section is constant and the second diameter of the second bore section is constant,
- wherein the second diameter is smaller than the first diameter,
- wherein a transition section between the first bore section and the second bore section has a conical shape so that the first diameter merges into the second diameter in a conical manner.
4 more elements
An electronic device, the electronic device comprising:
- an electronic component with electric terminals,
- a component carrier in which the electronic component is packaged, the component carrier having a layer stack formed of an electrically insulating structure and an electrically conductive structure;
- and
- a bore extending into the layer stack, the bore filled with a thermally conductive material and having a first bore section with a constant first diameter, a transition section, and a connected second bore section with a constant second diameter differing from the constant first diameter, the transition section having a conical shape such that the first bore section merges into the second bore section,
- wherein the second diameter is smaller than the first diameter,
- wherein the layer stack comprises a first surface and a second surface opposing the first surface,
- wherein the bore extends between the first surface and the second surface,
- wherein the thermally conductive material forms a pad section onto the second surface,
- wherein the thermally conductive material extends along the first surface for forming a heat radiation section,
- wherein the heat radiation section forms a first covering area onto the first surface and the pad forms a second covering area onto the second surface,
- wherein the first covering area is larger than the second covering area.
8 more elements
A method of manufacturing a component carrier, the method comprising:
- forming a layer stack of an electrically insulating structure and an electrically conductive structure;
- mechanically drilling a bore extending into the layer stack, wherein the bore has a first bore section with a first diameter, a transition section, and a connected second bore section with a second diameter differing from the first diameter, the transition section having a conical shape such that the first bore section merges into the second bore section;
- and
- introducing a thermally conductive material into the bore,
- wherein the layer stack comprises a first surface and a second surface opposing the first surface,
- wherein the bore extends between the first surface and the second surface,
- wherein the thermally conductive material forms a pad section onto the second surface,
- wherein the thermally conductive material extends along the first surface for forming a heat radiation section,
- wherein the heat radiation section forms a first covering area onto the first surface and the pad forms a second covering area onto the second surface,
- wherein the first covering area is larger than the second covering area.
7 more elements
Dependencies are inferred from the claim text.