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US 10,433,042 B2Granted
MEMS multi-module assembly, manufacturing method and electronics apparatus
AssigneeGoertek Inc.
InventorQuanbo Zou
Life of this patent
Estimating the term…
Abstract
A MEMS multi-module assembly, manufacturing method, and electronics apparatus are disclosed herein. The MEMS multi-module assembly comprises: a first die having a first hole; and a second die stacked on the first die, having a second MEMS device, wherein the second MEMS device is connected outside via the first hole.
Claims14
A MEMS (Micro Electromechanical System) multi-module assembly, comprising:
- a first die having a first MEMS device and a first hole;
- a second die stacked on the first die with a first space formed therebetween, the second die having a second MEMS device with a second hole, and
- a third die stacked on the second die having a third MEMS device, a second space being formed between the second die and the third die,
- wherein the first MEMS device is in communication with an area outside the assembly via the first hole and the first space, the second MEMS device is in communication with the area outside the assembly via the first hole, the first space, and the second hole, and the third MEMS device is in communication with the area outside the assembly via the first hole, the first space, the second hole, and the second space.
1 more element
A method for manufacturing a MEMS (Micro Electromechanical System) multi-module assembly, comprising:
- forming a first wafer, wherein the first wafer has at least one first MEMS device and has at least one first hole;
- forming a second wafer, wherein the second wafer has at least one second MEMS device with at least one second hole;
- stacking the second wafer onto the first wafer with a first space formed therebetween;
- and
- forming a third wafer, wherein the third wafer has at least one third MEMS device;
- stacking the third wafer onto the second wafer with a second space formed therebetween;
- and
- singulating the wafers at a wafer level, to form a MEMS multi-module assembly, wherein each wafer is singulated into at least one die,
- wherein the first MEMS device is in communication with an area outside the assembly via the first hole and the first space, the second MEMS device is in communication with the area outside the assembly via the first hole, the first space, and the second hole, and the third MEMS device is in communication with the area outside the assembly via the first hole, the first space, the second hole, and the second space.
6 more elements
Dependencies are inferred from the claim text.