Compound for forming organic film, composition for forming organic film, method for forming organic film, and patterning process
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsDaisuke Kori, Tsutomu Ogihara, Takeru Watanabe, Yoshinori Taneda, Rie Kikuchi
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Abstract
The present invention provides a compound for forming an organic film which has a minimum complex viscosity of 10 Pa·s or less when the complex viscosity is measured within a range of 50° C. to 300° C. This compound for forming an organic film can provide an organic film composition having high filling and planarizing properties.
Claims18
A compound for forming an organic film which has a minimum complex viscosity of 10 Pa·s or less when the complex viscosity is measured within a range of 50° C. to 300° C.,
- wherein the compound is shown by the formula (1A),
- RR1)(m1+m2) (1A)
- wherein R represents a single bond, an organic group having 1 to 50 carbon atoms, an ether bond, a —SO— group, or a —SO2— group;
- R1 represents a group shown by the formula (1B);
- and m1 and m2 represent an integer satisfying 1≤m1≤5, 1≤m2≤5, and 2≤m1+m2≤8,
- —R1=—X1—X (1B)
- wherein X1 represents a group shown by the formula (1C);
- and X represents a group shown by the formula (1D),
- wherein (X) represents a bonding site to X,
- wherein X2 represents a divalent organic group having 1 to 10 carbon atoms;
- n1 represents 0 or 1;
- n2 represents 1 or 2;
- X3 represents a group shown by the formula (1E);
- and n5 represents 0, 1, or 2,
- wherein R10 represents a hydrogen atom or a saturated or unsaturated hydrocarbon group having 1 to 10 carbon atoms, in which a hydrogen atom of the benzene ring in the formula (1E) may be substituted with a methyl group or methoxy group.
A composition for forming an organic film, comprising:
- a compound for forming an organic film which has a minimum complex viscosity of 10 Pa·s or less when the complex viscosity is measured within a range of 50° C. to 300° C.;
- an organic solvent;
- and
- either or both of a compound shown by the formula (2A) and a compound shown by the formula (3A),
- RR2)(m3+m4) (2A)
- wherein R represents a single bond, an organic group having 1 to 50 carbon atoms, an ether bond, a —SO— group, or a —SO2— group;
- R2 represents a group shown by the formula (2B);
- and m3 and m4 represent an integer satisfying 1≤m3≤5, 1≤m4≤5, and 2≤m3+m4≤8,
- —R2=—X11—X′ (2B)
- wherein X11 represents a group shown by the formula (2C);
- and X′ represents a group shown by the formula (2D),
- wherein (X′) represents a bonding site to X′,
- wherein n3 represents 0 or 1;
- n4 represents 1 or 2;
- X4 represents a group shown by the formula (2E);
- and n6 represents 0, 1, or 2,
- wherein R11 represents a hydrogen atom or a saturated or unsaturated hydrocarbon group having 1 to 10 carbon atoms, in which a hydrogen atom of the benzene ring in the formula (2E) may be substituted with a methyl group or methoxy group,
- wherein R101, R102, R103, and R104 independently represent a hydroxyl group;
- m100 represents 1, 2, or 3;
- R100 represents a hydrogen atom or a hydroxyl group when m100 is 1, R100 represents a single bond or a group shown by the formula (3B) when m100 is 2, and R100 represents a group shown by the formula (3C) when m100 is 3;
- a hydrogen atom of the aromatic ring in the formula (3A) may be substituted with a methyl group or a methoxy group;
- m101 represents 0 or 1, m102 represents 1 or 2;
- m103 represents 0 or 1;
- m104 represents 1 or 2;
- m105 represents 0 or 1;
- when m101 is 0, n101 and n102 represent an integer satisfying 0≤n101≤3, 0≤n102≤3, and 1≤n101+n102≤4, and when m101 is 1, n101, n102, n103, and n104 represent an integer satisfying 0≤n101≤2, 0≤n102≤2, 0≤n103≤2, 0≤n104≤2, and 2≤n101+n102+n103+n104≤8,
- wherein * represents a bonding site;
- R106 and R107 represent a hydrogen atom or an organic group having 1 to 24 carbon atoms and no ester bond, and R106 and R107 may be bonded to form a cyclic structure,
- wherein * represents a bonding site;
- and R108 represents a hydrogen atom or an organic group having 1 to 15 carbon atoms.
A composition for forming an organic film, comprising:
- a compound for forming an organic film which has a minimum complex viscosity of 10 Pa·s or less when the complex viscosity is measured within a range of 50° C. to 300° C.;
- and
- an organic solvent that is a mixture of one or more organic solvents having a boiling point of lower than 180° C. and one or more organic solvents having a boiling point of 180° C. or higher.
Dependencies are inferred from the claim text.