Method for producing a multilayer MEMS component, and corresponding multilayer MEMS component
AssigneeRobert Bosch GmbH
InventorsArnd Kaelberer, Christian Zielke, Hans Artmann, Oliver Breitschaedel, Peter Borwin Staffeld
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Abstract
A method for manufacturing a multi-layer MEMS component includes: providing a multi-layer substrate that has a monocrystalline carrier layer, a monocrystalline functional layer having a front side and a back side, and a bonding layer located between the back side and the carrier layer; growing a first polycrystalline layer over the front side of the monocrystalline functional layer; removing the monocrystalline carrier layer; and growing a second polycrystalline layer over the back side of the monocrystalline functional layer.
Claims14
A method for manufacturing a multi-layer MEMS component, the method comprising:
- providing a multi-layer substrate that includes a monocrystalline carrier layer, a monocrystalline functional layer with a front side and a back side, and a bonding layer located between the back side and the carrier layer;
- growing a first polycrystalline layer over the front side of the monocrystalline functional layer;
- removing the monocrystalline carrier layer;
- and
- growing a second polycrystalline layer over the back side of the monocrystalline functional layer.
A multi-layer MEMS component, comprising:
- a first polycrystalline layer over a front side of a monocrystalline functional layer;
- and
- a second polycrystalline layer over a back side of the monocrystalline functional layer;
- wherein the bonding layer is patterned such that a functional region is exposed on the back side, the second polycrystalline layer is formed on the bonding layer, and a monocrystalline region is formed within the second polycrystalline layer on the exposed functional region as a back-side electrical contact region.
A multi-layer MEMS component, comprising:
- a first polycrystalline layer over a front side of a monocrystalline functional layer;
- and
- a second polycrystalline layer over a back side of the monocrystalline functional layer;
- wherein the monocrystalline functional layer is patterned such that the functional layer includes a plurality of functional regions between which there are passthrough holes to the bonding layer,
- wherein the component further comprises an insulating layer on the functional regions and in the passthrough holes, and
- wherein a passthrough hole is formed in the insulating layer, by which a functional region is exposed on the front side.
Dependencies are inferred from the claim text.