Component supply device and tape peeling method in component supply device
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorAtuyuki Horie
Life of this patent
Estimating the term…
Abstract
There is provided a component supply device for supplying a component to a component mounter, including: a transporter that transports a carrier tape in which the component is stored and of which an upper surface is sealed with a cover tape, along a transport path; a peeler that peels off the cover tape from the carrier tape via an opening portion disposed above the transport path; and a cover that makes an open state of the opening portion variable. The cover sets the open state of the opening portion to be any of a first open state allowing the peeler to capture the cover tape and a second open state where an opening size of the opening portion is smaller than that of the first open state and passage of the cover tape peeled off from the carrier tape is not impeded.
Claims16
A component supply device for supplying a component to a component mounter, the component supply device comprising:
- a transport path along which a carrier tape is transported, the carrier tape storing the component and having an upper surface sealed with a cover tape, and an opening portion being disposed in an upper side of the transport path;
- a transporter that transports the carrier tape along the transport path;
- a peeler that peels off the cover tape from the carrier tape via the opening portion;
- and
- a cover that makes an open state of the opening portion variable,
- wherein the cover sets the open state of the opening portion to be any of a first open state allowing the peeler to capture the cover tape and a second open state where an opening size of the opening portion is smaller than an opening size of the opening portion of the first open state and passage of the cover tape peeled off from the carrier tape is not impeded.
A tape peeling method for peeling off a cover tape from a carrier tape in a component supply device for supplying a component to a component mounter, the component supply device comprising a transport path along which the carrier tape is transported, the carrier tape storing the component and having an upper surface sealed with the cover tape, and an opening portion being disposed in an upper side of the transport path,
- the method comprising:
- transporting the carrier tape along the transport path;
- peeling off the cover tape from the carrier tape by a peeler via the opening portion;
- and,
- wherein an open state of the opening portion is variable by the cover, and
- wherein the open state of the opening portion is set to be any of a first open state allowing the peeler to capture the cover tape and a second open state where an opening size of the opening portion is smaller than an opening size of the opening portion of the first open state and passage of the cover tape peeled off from the carrier tape is not impeded.
Dependencies are inferred from the claim text.