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US 10,408,057 B1Granted
Material-removal systems, cutting tools therefor, and related methods
AssigneeApergy Bmcs Acquisition Corporation
InventorsRussell R. Myers, Grant K. Daniels, Heath C. Whittier
Life of this patent
Estimating the term…
Abstract
Embodiments described herein relate to material-removal systems and cutting tools that may be used in the material-removal systems. More specifically, for example, the material-removal systems, and particularly the cutting tools thereof, may engage and fail target material. In some instances, the material-removal systems may be used in mining operations.
Claims26
A material-removal system, comprising:
- a movable cutting head;
- and
- a plurality of cutting tools mounted on the cutting head, each of the plurality of cutting tools including a tool body having a front surface, a front slanted surface extending from the front surface, a back surface, one or more surfaces defining a pocket formed in the tool body between the front slanted surface and the back surface, and a cutting element brazed to the tool body to secure the cutting element at least partially within the pocket;
- wherein:
- each of the cutting elements of the plurality of cutting tools includes:
- a substrate brazed directly to at least one of the one or more surfaces defining the pocket, the substrate having a back surface and a front surface opposite to the back surface;
- and
- a superhard table bonded directly to the front surface of the substrate and including a substantially planar working surface offset from the front slanted surface and oriented at a back rake angle and a side rake angle with respect to the back surface of the substrate;
- and
- at least two of the plurality of cutting tools are positioned at different locations on the cutting head.
7 more elements
A method of removing material, the method comprising:
- moving a plurality of cutting tools about a rotation axis, each of the plurality of cutting tools includes a tool body including a front surface, a front slanted surface extending from the front surface, a back surface, and one or more surfaces defining a pocket formed in the tool body between the front slanted surface and the back surface, at least two of the plurality of cutting tools being positioned at different positions, and each of the plurality of cutting tools including a substrate having a front surface bonded directly to a superhard table that forms a working surface that is offset from the front slanted surface and at least a portion of a cutting end of the cutting tool, wherein the substrate of each of the plurality of cutting tools has a back surface opposite to the front surface and brazed directly to at least one surface of the pocket of the tool body thereof to secure the substrate at least partially within the pocket thereof;
- advancing the plurality of cutting tools toward a target material;
- and
- engaging the cutting ends and the working surfaces of the cutting tools with the target material, thereby failing at least some of the target material while having the working surfaces of the cutting tools oriented at a back rake angle and a side rake angle with respect to the back surface of the substrate.
1 more element
A material-removal system, comprising:
- a cutting head rotatable about a rotation axis;
- and
- a plurality of cutting tools mounted on the cutting head, each of the plurality of cutting tools including a tool body having a front surface, a front slanted surface extending from the front surface, a back surface, one or more surfaces defining a pocket formed in the tool body between the front slanted surface and the back surface, and a cutting element brazed to the tool body to secure the cutting element at least partially within the pocket;
- wherein:
- each of the cutting elements of the plurality of cutting tools includes:
- a substrate brazed directly to at least one of the one or more surfaces defining the pocket, the substrate having a back surface and a front surface opposite to the back surface;
- and
- a polycrystalline diamond table bonded directly to the front surface of the substrate, the polycrystalline diamond table includes a substantially planar working surface offset from the front slanted surface and oriented at a back rake angle of 15 degrees to 20 degrees and a side rake angle of 15 degrees to 20 degrees with respect to the back surface of the substrate;
- and
- at least two of the plurality of cutting tools are positioned at different radial locations relative to the rotation axis of the cutting head.
7 more elements
Dependencies are inferred from the claim text.