Aqueous dip-coating composition for electroconductive substrates, comprising both dissolved and undissolved bismuth

An aqueous coating composition, comprising:

• (A1) at least one cathodically depositable binder;
• (A2) optionally at least one crosslinking agent;
• (A3) at least 30 ppm of dissolved bismuth which is in the form of a complex, salt, or both, dissolved in the aqueous coating composition, based on a total weight of the aqueous coating composition;
• (A4) at least 100 ppm of non-dissolved bismuth which is in the form of a complex, salt, or both, not dissolved in the aqueous coating composition, based on the total weight of the aqueous coating composition;
• and
• (A5) at least one at least bidentate complexing agent suitable for complexing the dissolved bismuth and the non-dissolved bismuth, said at least bidentate complexing agent having at least two donor atoms selected from the group consisting of N, O, S, and mixtures thereof,
• wherein:
• the aqueous coating composition has a pH ranging from 4.0 to 6.5;
• the at least one at least bidentate complexing agent (A5) is present in the aqueous coating composition in an amount of at least 5 mol %, based on a total combined amount of the dissolved bismuth (A3) and the non-dissolved bismuth (A4) present in the aqueous coating composition;
• the at least one at least bidentate complex agent (A5) comprises an aminopolycarboxylic acid;
• an amount of the non-dissolved bismuth (A4) in mol % is greater than an amount of the dissolved bismuth (A3) in mol %;
• and
• the dissolved bismuth (A3) and the at least on at least bidentate complexing agent (A5) are present in the form of a complex, a salt, or both, of the dissolved bismuth (A3) and the at least one at least bidentate complexing agent (A5) in the aqueous coating composition.