# US 10,403,782 B2 · Laser scribing of thin-film solar cell panel > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,403,782 B2 - Document ID: US10403782B2 - Status: Granted - Kind: B2 - Application number: 15/431,782 - Filed: 2017-02-14 - Published: 2017-08-10 - Granted: 2019-09-03 - Earliest claimed: 2017-02-14 - Assignees: Manufacturing Integration Technology Ltd - Applicants: Manufacturing Integration Technology Ltd - Inventors: Kim Mone Kwong; Teck Keong Boh; Kok Yeow Lim; Han Yong Lam - Web page: https://patentgrep.com/patent/US10403782B2 ## CPC - H10F 71/137: {Batch treatment of the devices} - B23K 26/083: {Devices involving movement of the workpiece in at least one axial direction} - B23K 26/0869: {Devices involving movement of the laser head in at least one axial direction} - B23K 26/40: taking account of the properties of the material involved - H10F 10/00: Individual photovoltaic cells, e.g. solar cells (electrolytic light-sensitive devices, e.g. dye-sensitised solar cells, H01G9/20) - H10F 71/00: Manufacture or treatment of devices covered by this subclass (patterning processes to connect thin photovoltaic cells in integrated devices, or assemblies of multiple devices, having photovoltaic cells H10F19/33; manufacture or treatment of encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells H10F19/80; manufacture or treatment of integrated devices, or assemblies of multiple devices, comprising at least one element in which radiation controls the flow of current H10F39/00) - H10F 71/133: {Providing edge isolation} - H10F 71/134: {Irradiation with electromagnetic or particle radiation} - B23K 2103/50: {Inorganic materials other than metals or composite materials} - B23K 2103/56: {being semiconducting} - G02B 26/10: Scanning systems - Y02E 10/50: Photovoltaic [PV] energy - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM - G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS - Y02E: REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION ## Abstract A method for laser scribing of thin-films for the manufacture of solar cell panels comprises loading a workpiece with the transparent substrate facing downwards in an input station of a first machine; biasing a reference edge of the workpiece against a front and rear stopper associated with a linear drive; translating the workpiece back and forth between the input station and output station and firing two or more laser beams at a first frequency substantially vertically through a space between the input and output stations to pass through the transparent substrate of the workpiece to scribe parallel lines on the front electrodes with reference to the edge of the workpiece in contact with the front and rear stoppers; and indexing the two or more laser sources and repeating the back and forth translation of the work piece between the input and output stations. ## Claims ### Claim 1 A laser scribing process for the manufacture of a thin-film solar panel, the process comprising: loading a planar workpiece with a transparent substrate facing downwards in an input station of a laser scribing machine; biasing a reference edge of the planar workpiece to contact both a fixed stopper and an adjustable stopper associated with a linear drive, wherein the linear drive is operated to translate the planar workpiece between the input station and an output station; determining amounts of deviations of the reference edge or a reference line at the reference edge from the linear drive from a front end to a rear end of the planar workpiece, and adjusting the adjustable stopper accordingly by rotating the planar workpiece in a flat plane spanning the planar workpiece so as to correct parallelism of the reference edge or reference line with the linear drive; translating the planar workpiece back and forth between the input station and the output station and firing a laser beam at a first frequency vertically through a space between the input and output stations to pass through the transparent substrate of the planar workpiece to scribe parallel lines (LP1) on a front electrode layer, which is disposed on an upper face of the transparent substrate, wherein the laser beam is outputted from a laser source that is mounted on an independently motorized axis disposed transverse to the linear drive; and indexing the laser source at a predetermined pitch transversely to the linear drive and repeating the back and forth translation of the planar workpiece between the input and output stations until the entire front electrode layer is divided into parallel strips of a uniform width that are electrically isolated one from another; providing a number of laser sources and dividing an area of laser scribing on the planar workpiece into a number of gangs according to the number of laser sources, and conducting laser scribing on the planar workpiece simultaneously in the respective gangs; the method further comprising: reloading the planar workpiece formed with parallel, uniform strips of the front electrode layer and disposed with a new semiconductor layer or a rear electrode layer in the input station; biasing the reference edge of the planar workpiece to contact both the fixed stopper and the adjustable stopper; aligning a scribed line (Lp1) on the front electrode layer with the linear drive by using a measuring camera (C1-C4) disposed above the planar workpiece and another measuring camera (C5) disposed near the adjustable stopper to determine a correction required to align parallelism between the scribed line (Lp1) with the linear drive, adjusting the adjustable stopper accordingly by rotating the planar workpiece in the flat plane to achieve the required parallelism, and adjusting position of each of the laser sources, when necessary, to achieve scribing strips of a uniform width; translating the workpiece back and forth between the input station and output station and firing laser beams at a second frequency vertically through the space between the input and output stations to pass through the transparent substrate of the planar workpiece to scribe parallel lines (Lp2, Lp3) on the semiconductor layer or rear electrode layer parallel to the previously scribed lines (Lp1 or Lp2); and indexing the laser sources, and repeating the back and forth translation of the planar workpiece between the input and output stations until the entire semiconductor layer or rear electrode layer is divided into parallel strips of a uniform width that are electrically isolated one from another. ### Claim 2 (depends on 1) The laser scribing process according to claim 1, wherein parallelism alignment is carried out manually with a dummy workpiece. ### Claim 3 (depends on 1) The laser scribing process according to claim 1, wherein determining amounts of deviations of the reference edge or reference line from the linear drive is carried out with at least one of the measuring camera or the another measuring camera, and the planar workpiece parallelism alignment is carried out at a beginning of each laser scribing step. ### Claim 4 (depends on 1) The laser scribing process according to claim 1, wherein the planar workpiece parallelism alignment is carried out with a precision jig. ### Claim 5 (depends on 1) The laser scribing process according to claim 1, wherein the planar workpiece parallelism alignment is carried out dynamically during the laser scribing process. ### Claim 6 (depends on 1) The laser scribing process according to claim 1, further scribing a front isolation line (Lf) and a rear isolation line (Lr). ### Claim 7 A laser scribing process for the manufacture of a thin-film solar panel, the process comprising: loading a planar workpiece with a transparent substrate facing downwards in an input station of a laser scribing machine; biasing the planar workpiece so that a reference edge of the planar workpiece contacts both a fixed stopper and an adjustable stopper associated with a linear drive; wherein the linear drive is operated to translate the planar workpiece between the input station and an output station; aligning a reference line or a reference edge of the planar workpiece with the linear drive by using a measuring camera (C1-C4) disposed above the planar workpiece and another measuring camera (C5) disposed near the adjustable stopper to determine a correction required to achieve parallelism between the reference line or reference edge with the linear drive, and adjusting the adjustable stopper accordingly by rotating the workpiece in a flat plane spanning the planar workpiece to achieve the required parallelism between the reference line or reference edge with the linear drive; translating the planar workpiece back and forth between the input station and the output station and firing two or more laser beams at a first frequency vertically, through a space between the input and output stations, through the transparent substrate of the planar workpiece to scribe parallel lines (LP1) on a front electrode layer disposed on an upper face of the transparent substrate; wherein each of the two or more laser beams is outputted from a separate laser source, which each laser source is mounted on an independently motorized axis disposed transverse to the linear drive; indexing the two or more laser sources at predetermined pitches transverse to the linear drive, and repeating the back and forth translation of the planar workpiece between the input and output stations until the entire front electrode layer is divided into parallel strips of a uniform width that are electrically isolated one from another; aligning a scribed line (Lp1) on the front electrode layer with the linear drive by using the measuring camera (C1-C4) disposed above the planar workpiece and the another measuring camera (C5) disposed near the adjustable stopper to determine a correction required to achieve parallelism between the scribed line (LP1) with the linear drive, and adjusting the adjustable stopper accordingly by rotating the planar workpiece in the flat plane to achieve parallelism; wherein each of the measuring cameras is mounted on an independently motorized axis disposed transverse to the linear drive; adjusting positions of the two or more laser sources, when necessary, to achieve scribing strips of a uniform width; translating the workpiece back and forth between the input station and the output station and firing two or more laser beams at a second frequency vertically, through the space between the input and output stations, through the transparent substrate of the planar workpiece to scribe parallel lines (Lp2, Lp3) on a new semiconductor layer or a rear electrode layer disposed on the planar workpiece; and indexing the two or more laser sources, and repeating the back and forth translation of the planar workpiece between the input and output stations until the entire semiconductor layer or rear electrode layer is divided into parallel strips of a uniform width that are electrically isolated one from another. ### Claim 8 (depends on 7) The laser scribing process according to claim 7, wherein parallelism alignment is carried out manually with a dummy workpiece. ### Claim 9 (depends on 7) The laser scribing process according to claim 7, wherein the planar workpiece parallelism alignment is carried out with a precision jig at the beginning of each laser scribing step. ### Claim 10 (depends on 7) The laser scribing process according to claim 7, wherein the planar workpiece parallelism alignment is carried out dynamically during the laser scribing process. ### Claim 11 (depends on 7) The laser scribing process according to claim 7, further scribing a front isolation line (Lf) and a rear isolation line (Lr).