Low-melting adhesive film
AssigneesHyundai Motor Company, Kia Motors Corporation, Hanmin Automotive Trim Industries, Samsung Gratech. Co., Ltd.
InventorsJung Min Park, Ho Dal Lee, Jong Heon Lee, Eun Kyung Lee, Ki Hyun Yoo
Life of this patent
Estimating the term…
Abstract
A low-melting adhesive film may include a first adhesive layer made of a material comprising thermoplastic polyurethane, a second adhesive layer made of a material comprising aromatic-based hot-melt thermoplastic polyurethane capable of being applied to low temperature adhesion at a temperature of 60° C. or higher, and a polyethylene (PE)-based protective film layer. The low-melting adhesive film may be used to adhere a carpet fabric to a sound absorbing material and thus produce an integrated sound absorbing and proofing composite carpet.
Claims11
A adhesive film comprising:
- a first adhesive layer made of a material comprising thermoplastic polyurethane;
- a second adhesive layer made of a material comprising aromatic-based hot-melt thermoplastic polyurethane capable of being applied to adhesion at a temperature of 60° C. to 65° C.;
- and
- a polyethylene (PE)-based protective film layer,
- wherein the second adhesive layer made of the material comprising 7˜10 wt % of adipic acid, 10˜40 wt % of MDI (methylene diphenyldiiocyanate), 3˜13 wt % of 1,4-butanediol and 40˜80 wt % of polyol,
- wherein the second adhesive layer is located between the first adhesive layer and the polyethylene(PE)-based protective film layer, and
- wherein the second adhesive layer is melted at a temperature ranging from 65 to 70° C.
A adhesive film comprising:
- a first adhesive layer made of a material comprising thermoplastic polyurethane;
- a second adhesive layer made of a material comprising aromatic-based hot-melt thermoplastic polyurethane capable of being applied to adhesion at a temperature of 65° C.;
- and
- a polyethylene (PE)-based protective film layer,
- wherein the second adhesive layer made of the material comprising 7˜10 wt % of adipic acid, 10˜40 wt % of MDI (methylene diphenyldiiocyanate), 3˜13 wt % of 1,4-butanediol and 40˜80 wt % of polyol,
- wherein the second adhesive layer is located between the first adhesive layer and the polyethylene(PE)-based protective film layer, and
- wherein the second adhesive layer is melted at a lowest temperature of 65° C.
Dependencies are inferred from the claim text.