Method for manufacturing electronic component

A method for manufacturing an electronic component, the method comprising:

• inserting a plurality of multilayer chips into a plurality of cavities formed in a pallet, respectively, the plurality of multilayer chips each including a laminated body having a plurality of ceramic layers and a plurality of internal electrode layers;
• aligning the plurality of multilayer chips by moving each of the plurality of multilayer chips to one of inner wall surfaces that form the cavities;
• providing a liquid repellent film that repels a conductive ink on an upper surface of the pallet;
• applying the conductive ink to ends of the plurality of aligned multilayer chips, and the liquid repellent film on the upper surface of the pallet;
• and
• drying the applied conductive ink to form external electrodes on the plurality of multilayer chips
• wherein in the applying step, the conductive ink which adheres to the upper surface of the pallet in the application is guided into the cavities or a region of the upper surface of the pallet, the region being a region without the liquid repellent film provided.