Pressure-sensitive adhesive composition, pressure-sensitive adhesive film, and method of manufacturing organic electronic device using the same

A pressure-sensitive adhesive composition, comprising:

• an encapsulating resin which is a copolymer of a diene and an olefin-based compound having one carbon-carbon double bond, wherein the encapsulating resin has a weight average molecular weight (Mw) of 100,000 to 2,000,000;
• a tackifier;
• a multifunctional active energy ray-polymerizable compound which is included at 5 to 18 parts by weight relative to 100 parts by weight of the encapsulating resin;
• and
• a silane compound satisfying Formula 1,
• wherein the pressure-sensitive adhesive composition has a gel content represented by Equation 1 of 50% or more, and
• wherein the active energy ray-polymerizable compound forms a crosslinking structure with the silane compound satisfying Formula 1, and the encapsulating resin forms a crosslinking structure with the active energy ray-polymerizable compound or the silane compound satisfying Formula 1, thereby forming an interpenetrating polymer network:
• wherein R1 is hydrogen or an alkyl group, R2 and R3 are each independently hydrogen, or a linear, branched, or cyclic alkyl group, or R2 is linked with R3, thereby forming a cyclic alkyl group, R4, R5, and R6 are each independently hydrogen, an alkyl group, or an alkoxy group, at least one of R4, R5, and R6 is an alkoxy group, and n is an integer of 1 or more,
• Gel content (%)=B/A×100 [Equation 1]
• wherein A is a mass of the pressure-sensitive adhesive composition, and B is a dry mass of an insoluble content of the pressure-sensitive adhesive composition remaining after being dipped in toluene at 60° C. for 24 hours and filtered through a 200-mesh filter (pore size of 200 μm).