Injection molding apparatus
AssigneeHuawei Technologies Co., Ltd.
InventorGuo Yang
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AssigneeHuawei Technologies Co., Ltd.
InventorGuo Yang
Estimating the term…
The present disclosure provides an injection molding apparatus, including a fixed mold component, a movable mold component, a first positive electrode module, and a first negative electrode module. The fixed mold component has an injection port and a transmission runner, to receive injection-molding melt. The movable mold component has a molding groove communicated with the transmission runner. The first positive electrode module and the first negative electrode module are disposed on a first side and a second side of the molding groove respectively, where the first side and the second side are opposite to each other. The first positive electrode module cooperates with the first negative electrode module to form an electric field between the first side and the second side of the molding groove, to perform electric field excitation on the injection-molding melt flowing into the molding groove.
An injection molding apparatus, configured to receive injection-molding melt to solidify the injection-molding melt into an injection molded part, wherein the injection molding apparatus comprises:
An injection molding apparatus, configured to receive injection-molding melt to solidify the injection-molding melt into an injection molded part, wherein the injection molding apparatus comprises:
An injection molding apparatus, configured to receive injection-molding melt to solidify the injection-molding melt into an injection molded part, wherein the injection molding apparatus comprises:
Dependencies are inferred from the claim text.