Light-emitting device and manufacturing method thereof
AssigneeGenesis Photonics Inc.
InventorsChin-Hua Hung, Cheng-Wei Hung, Yu-Feng Lin, Cheng-Chuan Chen
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Abstract
A light-emitting device includes a substrate, a light-emitting component, a translucent layer, an adhesive layer, a reflective layer and translucent encapsulant. The light-emitting component is disposed on the substrate. The adhesive layer is formed between the light-emitting component and the translucent layer. The reflective layer is formed above the substrate and covering a lateral surface of the light-emitting component, a lateral surface of the adhesive layer and a lateral surface of the translucent layer. The translucent encapsulant is formed on the substrate and encapsulating the light-emitting component, the translucent layer and the reflective layer.
Claims11
A light-emitting device, comprises:
- a substrate;
- a light-emitting component coupled to the substrate;
- a wavelength conversion layer comprising a high-density phosphor layer and a low-density phosphor layer;
- an adhesive layer adhering the wavelength conversion layer directly to an upper surface of the light-emitting component and covering a portion of a lateral surface of the light-emitting component, wherein the high-density phosphor layer faces to the upper surface of the light-emitting component;
- a reflective layer formed above the substrate and covering the light-emitting component, the adhesive layer and the wavelength conversion layer to expose an upper surface of the wavelength conversion layer, wherein a curved surface of the reflective layer is inclined to the lateral surface of the light-emitting component and reflects a light emitted from the light-emitting component back into the high-density phosphor layer;
- and
- a dome-shaped lens layer formed on the substrate and encapsulating the light-emitting component, the wavelength conversion layer, the adhesive layer and the reflective layer.
Dependencies are inferred from the claim text.