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US 10,388,480 B2Granted
Dual element fuse and methods of manufacture
AssigneeEaton Intelligent Power Limited
InventorsFrederick Eugene Still, Abraham Joshua Miller, Gilberto Jaquez
Life of this patent
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Abstract
A dual element electrical fuse includes at least one high overcurrent fusible element and a low overcurrent fusible element connected to one another inside a housing. The low overcurrent fusible element includes a single sided circuit board and a releasable conductive element that more simply provides low overcurrent protection and manufacturing efficiency with improved quality.
Claims19
An electrical fuse comprising:
- a housing;
- and
- a low overcurrent fusible element connected in series between a first high overcurrent fusible element and a second high overcurrent fusible element inside the housing, wherein the low overcurrent fusible element comprises:
- a nonconductive substrate having a first major surface and a second major surface opposite the first major surface;
- a conductive layer provided on the first major surface of the nonconductive substrate, the conductive layer defining a first conductive portion and a second conductive portion separated from one another by a nonconductive gap, wherein each of the first conductive portion and the second conductive portion is series connected to a respective one of the first high overcurrent fusible element and the second high overcurrent fusible element and wherein the second major surface of the nonconductive substrate is not provided with a conductive layer;
- a releasable conductive element extending on the second major surface of the nonconductive substrate, the releasable conductive element including a first end and a second end;
- a low melting point solder extending on the first major surface of the nonconductive substrate without extending on the second major surface of the nonconductive substrate, the low melting point solder establishing a first current path from the first conductive portion on the first major surface of the nonconductive substrate to the first end of the releasable conductive element;
- and
- a high melting point solder extending on the first major surface of the nonconductive substrate without extending on the second major surface of the nonconductive substrate, the high melting point solder establishing a second current path between the second end of the releasable conductive element and the second conductive portion on the first major surface.
6 more elements
Dependencies are inferred from the claim text.