Device and method for manufacturing emblem with incorporated IC chip

A method of manufacturing an emblem of a thermoplastic synthetic resin material with an incorporated IC chip by high frequency dielectric heating, the method comprising:

• arranging a sheet of release paper on a flat upper surface of a table, the table operating as cathode, and arranging an upper layer material on an upper surface of the sheet of release paper;
• pressing the upper layer material with an upper metal mold from above the upper layer material and subjecting the upper layer material to high frequency dielectric heating such that a given shape is imparted to the upper layer material and an intermediate is produced;
• arranging for the upper metal mold to temporarily hold the intermediate and lifting the upper metal mold along with the intermediate;
• axially sliding a slide board disposed on the table such that a recessed section formed on an upper surface of a metal plate is placed on the slide board below the upper metal mold;
• placing the sheet of release paper, a lower layer material, and the IC chip on the recessed section;
• and
• lowering the upper metal mold to press the intermediate, the IC chip, and the lower layer material, and subjecting the intermediate, the IC chip, and the lower layer material to high frequency dielectric heating so as to bond the intermediate and the lower layer material together by fusion bonding.