Component crimping device and component crimping method
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorShigeru Sueno
Life of this patent
Estimating the term…
Abstract
An object of the present disclosure is to provide a component crimping device and a component crimping method that make it possible to improve accuracy of attaching a component onto a substrate by preventing the component from being excessively elongated due to rapid thermal expansion when the component is pressed against the substrate. A lower surface side of a substrate-side terminal part of a substrate held by a substrate holding table is supported by a support, a component placed on a placing table is picked up by a crimping head while heating the component, the component is compressed against a compressing table so as to be elongated, and then the component is pressed against the substrate-side terminal part.
Claims10
A component crimping device comprising:
- a substrate holding table that holds a substrate;
- a support that supports a lower surface side of a terminal part of the substrate held by the substrate holding table;
- a component placing part on which a component to be crimped onto the terminal part is placed;
- a crimping head that picks up the component placed on the component placing part while heating the component;
- a component compressing part against which the component is compressed, the component compressing part being separate from the substrate holding table and the support;
- and
- a controller that controls operation of the crimping head such that the crimping head picks up the component placed on the component placing part, heats the picked up component, compresses the heated component against the component compressing part so as to elongate the heated component, and then presses the elongated component against the terminal part supported by the support.
A component crimping method comprising:
- holding a substrate by a substrate holding table;
- supporting, by a support, a lower surface side of a terminal part of the substrate held by the substrate holding table;
- picking up, by a crimping head, a component placed on a component placing part while heating the component;
- compressing, by the crimping head, the component thus picked up and heated against a component compressing part so as to elongate the component, the component compressing part being separate from the substrate holding table and the support;
- and
- pressing, by the crimping head, against the terminal part supported by the support, the component thus elongated by being compressed against the component compressing part.
Dependencies are inferred from the claim text.