Heat transfer chassis and method for forming the same

A system comprising:

• a chassis including a front plate, a rear plate, and first and second side plates coupled to and extending between the front plate and the rear plate to define a chamber, the chassis further including a bridge heat sink coupled to and extending between the front and rear plates between the first and second side plates, the bridge heat sink including a first conductive plate that defines a left planar side wall and a second conductive plate that defines a right planar side wall, wherein interior surfaces of the first and second conductive plates define a fluid channel therethrough that is fluidly connected to corresponding slots defined through the front and rear plates, wherein the one or more electronics packages are engaged with one or more of the left planar side wall of the first conductive plate or the right planar side wall of the second conductive plate at one or more positions along a length of the left planar side wall or the right planar side wall, the chassis configured to receive a first cooling fluid through the slots of the front and rear plates and the fluid channel of the bridge heat sink to dissipate heat from one or more electronics packages engaging one or more of the left planar side wall of the first conductive plate or the right planar side wall of the second conductive plate of the bridge heat sink within the chamber;
• a fin bank mounted to the first side plate along an outer side thereof that faces away from the second side plate;
• and
• a heat pipe coupled to the front plate, the heat pipe containing a second cooling fluid therein, the heat pipe extending to and a distance through the fin bank, the heat pipe providing a closed fluid path for the second cooling fluid to transfer heat absorbed from the front plate to the fin bank for dissipating heat to an external environment.

A system comprising:

• plural bridge heat sinks;
• a chassis including a front plate, a rear plate, and first and second side plates coupled to and extending between the front plate and the rear plate to define a chamber, wherein each of the bridge heat sinks is coupled to and extends between the front and rear plates between the first and second side plates, the bridge heat sinks defining respective fluid channels therethrough that are fluidly connected to corresponding slots defined through the front and rear plates, the chassis configured to receive a first cooling fluid through the slots of the front and rear plates and the fluid
• channels of the bridge heat sinks to dissipate heat from plural electronics packages engaging the bridge heat sinks within the chamber, each of the electronics packages comprising a respective thermally conductive panel having a first planar side and a second planar side;
• a fin bank mounted to the first side plate along an outer side thereof that faces away from the second side plate;
• and
• a heat pipe coupled to the front plate, the heat pipe containing a second cooling fluid therein, the heat pipe extending to and a distance through the fin bank, the heat pipe providing a closed fluid path for the second cooling fluid to transfer heat absorbed from the front plate to the fin bank for dissipating heat to an external environment;
• wherein for each bridge heat sink, the bridge heat sink respectively includes a first conductive plate that defines a left planar side wall and a second conductive plate that defines a right planar side wall, wherein the fluid channel of the bridge heat sink is defined between interior surfaces of the first and second conductive plates, and wherein a respective two electronics packages of the plural electronics packages respectively face the left and right planar side walls and are engaged with the first and second conductive plates such that heat from the two electronics packages is conducted through the first and second conductive plates and transferred to the first cooling fluid passing through the fluid channel of the bridge heat sink, the fluid channel disposed between the two electronics packages;
• and
• wherein one of the respective left planar side wall or the right planar side wall of each of two or more of the bridge heat sinks abuts the first planar side of the thermally conductive panel of the respective electronics package engaged therewith, across a respective engagement interface that extends a full length of the thermally conductive panel, electronics components of said respective electronics package coupled to the second planar side of the thermally conductive panel and not to the first planar side of the thermally conductive panel.