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US 10,383,253 B1Granted
Sealable multi-surface electronics thermal conduction package
AssigneeNIO USA, Inc.
InventorNermin Mujcinovic
Life of this patent
Estimating the term…
Abstract
An electronics thermal conduction package is provided. The package may include a housing and an interior space, or envelope, configured to receive a printed circuit board assembly (“PCBA”) with one or more microprocessors or other heat generating elements. The package can be elastically deformed to open a dimension of the envelope, or receiving cavity, such that a complete PCBA can be inserted inside the interior space of the package. Once inserted, the package may be returned to its undeformed, or substantially undeformed, state such that surfaces in the interior space of the package contact one or more of the heat generating elements on the PCBA creating a conductive thermal path from the heat generating elements to the housing of the package.
Claims20
An electronics package, comprising:
- a body having a peripheral shape including a first side and an opposite second side, and an upper portion and a lower portion disposed between the first and second sides, the peripheral shape extending along a length, the body including a first end surface disposed at a first end of the length and a second end surface disposed at a second end of the length;
- a receiving cavity disposed inside the peripheral shape between the first and second sides and the upper and lower portions, the receiving cavity passing through the body from the first end surface to the second end surface;
- and
- a controlled bend feature disposed in the upper portion of the peripheral shape of the body, wherein the controlled bend feature includes an elastically flexible region of material shaped to direct forces applied to the first and/or second sides along the upper portion and in a direction outwardly from a center of the receiving cavity, and wherein the controlled bend feature includes a cross-sectional area less than a cross-sectional area of the upper portion.
1 more element
An integrated electronics package, comprising:
- a body having a peripheral shape including a first side and an opposite second side, and an upper portion and a lower portion disposed between the first and second sides, the peripheral shape extending along a length, the body including a first end surface disposed at a first end of the length and a second end surface disposed at a second end of the length;
- a receiving cavity disposed inside the peripheral shape between the first and second sides and the upper and lower portions, the receiving cavity passing through the body from the first end surface to the second end surface;
- a controlled bend feature disposed in the upper and lower portions of the peripheral shape of the body, wherein the controlled bend feature includes an elastically flexible region of material shaped to direct forces applied to the first and/or second sides along the upper and lower portions and in a direction outwardly from a center of the receiving cavity;
- a printed circuit board assembly (PCBA) disposed in the receiving cavity and between the first and second end surfaces of the body;
- a first endplate substantially matching the peripheral shape of the body;
- and
- a second endplate substantially matching the peripheral shape of the body, wherein the first endplate is mechanically attached to the first end surface, wherein the second endplate is mechanically attached to the second end surface, and wherein an environment surrounding the PCBA inside the receiving cavity is sealed from an environment outside the receiving cavity.
4 more elements
A method of assembling an integrated electronics package, comprising:
- providing an electronics package, comprising:
- a body having a peripheral shape including a first side and an opposite second side, and an upper portion and a lower portion disposed between the first and second sides, the peripheral shape extending along a length, the body including a first end surface disposed at a first end of the length and a second end surface disposed at a second end of the length;
- a receiving cavity disposed inside the peripheral shape between the first and second sides and the upper and lower portions, the receiving cavity passing through the body from the first end surface to the second end surface;
- and
- a controlled bend feature disposed in the upper and lower portions of the peripheral shape of the body, wherein the controlled bend feature includes an elastically flexible region of material shaped to direct forces applied to the first and/or second sides along the upper and lower portions and in a direction outwardly from a center of the receiving cavity;
- aligning a printed circuit board assembly (PCBA) with the receiving cavity of the body;
- applying a compressive force to the first and/or second side of the body, wherein the compressive force flexes the controlled bend features and moves the upper portion and lower portion in opposite directions outwardly from the center of the receiving cavity providing a PCBA clearance height inside the receiving cavity;
- inserting the PCBA into the receiving cavity having the PCBA clearance height, while the compressive force is maintained, wherein the PCBA is positioned between the first and second ends of the body;
- releasing the compressive force applied, wherein upon releasing the compressive force applied the controlled bend features return to an unflexed state moving the upper portion and lower portion in a direction toward the center of the receiving cavity providing a reduced PCBA clearance height clamping the PCBA inside the receiving cavity;
- attaching a first endplate to the first end of the body;
- and
- attaching a second endplate to the second end of the body, wherein attachment of the first and second endplates isolate an environment surrounding the PCBA inside the receiving cavity from an environment outside the receiving cavity.
9 more elements
Dependencies are inferred from the claim text.