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US 10,383,236 B2Granted
Manufacturing method for circuit board based on copper ceramic substrate
AssigneeShunsin Technology (Zhong Shan) Limited
InventorFei Ren
Life of this patent
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Abstract
A manufacturing method for circuit board on copper ceramic substrate comprises stamping a copper sheet into a copper circuit board in a shape matching a ceramic substrate, fitting the copper circuit board to the ceramic substrate and sintering the copper circuit board and the ceramic substrate together by direct bonding copper.
Claims7
A manufacturing method for copper ceramic substrates, comprising:
- stamping a copper sheet into a copper circuit board in a shape matching a ceramic substrate;
- fitting the copper circuit board to the ceramic substrate;
- sintering the copper circuit board and the ceramic substrate by direct copper bonding;
- and
- magnetron sputtering a surface coating of one of a Fe layer, a Ti layer, or a Al layer on the copper circuit board following the process of sintering the copper circuit board.
2 more elements
Dependencies are inferred from the claim text.