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US 10,383,235 B2Granted
Method of manufacturing printed-circuit board assembly
AssigneeSamsung Electronics Co., Ltd.
InventorsJung-Je Bang, Mi-Jin Kim, Sae-Bom Lee, Hyun-Joo Han, Kun-Tak Kim
Life of this patent
Estimating the term…
Abstract
A method is provided for manufacturing a printed circuit board assembly. A method includes applying a liquefied radiant-heat material on a heating component mounted on the printed circuit board; mounting a shield unit on the printed circuit board in contact with the liquefied radiant-heat material; and simultaneously curing the liquefied radiant-heat material and bonding the shield unit.
Claims15
A method of manufacturing a printed circuit board assembly, the method comprising:
- applying solder to a plurality of bonding pads provided on the printed circuit board;
- mounting an electronic component on the applied solder;
- applying a liquefied radiant-heat material on the electronic component;
- mounting a shield unit on at least one of the bonding pads, the shield unit contacting the liquefied radiant-heat material;
- and
- applying heat at a temperature that simultaneously bonds the electronic component and the shield unit and cures the liquefied radiant-heat material.
3 more elements
A method of manufacturing a printed circuit board assembly, the method comprising:
- applying solder, at a first temperature, to a plurality of bonding pads provided on the printed circuit board;
- mounting an electronic component on the applied solder;
- bonding the electronic component to the printed circuit board through heating;
- applying an under-fill resin material for reinforcing a strength of the electronic component;
- applying a liquefied radiant-heat material on the electronic component;
- mounting a shield unit on the shield unit bonding pad, the shield unit contacting the liquefied radiant-heat material;
- and
- applying heat at a temperature that simultaneously cures the under-fill resin material and the liquefied radiant-heat material and bonds the shield unit and the electronic component.
5 more elements
Dependencies are inferred from the claim text.