Method for utilizing surface mount technology on plastic substrates

A method for forming an electronic circuit on a two-shot injection molded plastic substrate, comprising:

• using two-shot injection molding to form a first shot and a second shot of the two-shot injection molded plastic substrate, each shot being a separate plastic part;
• laser etching at least a portion of the second shot of the two shot injection molded plastic substrate;
• activating via laser selective gloss-plating of at least the laser-etched portion to form one or more electrically conductive traces;
• placing at least two electrically conductive pads at predetermined positions along the one or more electrically conductive traces that maximize an amount of surface area contact between the at least two electrically conductive pads and the molded plastic substrate;
• surface mounting an electrical component to the at least two electrically conductive pads using electrically conductive bonding material;
• and
• mechanically supporting the second shot of the two shot injection molded plastic substrate having thereon the surface mounted electrical component via the first shot of the two shot injection molded plastic substrate, wherein the first shot of the two shot injection molded plastic substrate is formed of non-platable polycarbonate.