Thermoformed plastic cover for electronics and related method of manufacture

A method for manufacturing a multilayer structure for an electronic device, comprising:

• obtaining a flexible substrate film for accommodating electronics, providing a number of conductor traces on the flexible substrate film for electrically powering and/or connecting electronic components,
• providing at least one electronic component on the flexible substrate film,
• placing at least one thermoformed cover on top of the at least one electronic component,
• attaching the at least one thermoformed cover to the flexible substrate film,
• molding a thermoplastic material on the at least one thermoformed cover and substrate film accommodating the electronic components after attaching the at least one thermoformed cover to the flexible substrate film, wherein the attaching comprises securing the at least one cover with hook and loop fasteners.

An electronic device comprising:

• a flexible substrate film for accommodating electronics;
• at least one electronic component provided on the flexible substrate film;
• and
• a number of conductive traces provided on the flexible substrate film for electrically powering and/or connecting electronics including the at least one electronic component, and wherein at least one cover is attached to the flexible substrate film on top of the at least one electronic component, the at least one cover being overmolded with thermoplastic material, the at least one cover being attached to the flexible substrate film with hook and loop fasteners independent of being overmolded with the thermoplastic material.