Component-embedded board and method of manufacturing same

A component-embedded board comprising:

• a first board comprising a first insulation layer having a first face and a second face, a first conductive layer formed on the second face of the first insulation layer, and an interlayer conductive portion penetrating the first insulation layer to be connected to the first conductive layer and protruding from the first face of the first insulation layer;
• an electric component connected to the interlayer conductive portion;
• a second board comprising a second insulation layer having a first face, a second face, and an opening portion incorporating the electric component, and second conductive layers formed on both the first face and the second face of the second insulation layer;
• and
• an adhesive layer that bonds the first board with the electronic component and the second board,
• wherein the second conductive layers formed on the first face of the second insulation layer comprise a first frame portion having a frame shape in a plan view,
• wherein the second conductive layers formed on the second face of the second insulation layer comprise a second frame portion having a frame shape in a plan view,
• wherein the opening portion is formed so as to penetrate the second insulation layer in a thickness direction thereof over the entirety of an inner region of the first frame portion, the inner region defined by an inner peripheral edge of the first frame portion,
• wherein an edge of the first frame portion is collinear with an edge of the second insulation layer that defines the opening portion,
• wherein the first frame and second frame portions are electrically disconnected from the remaining parts of the second conductive layers,
• wherein an area of the inner region of the second frame portion is greater than an area of the inner region of the first frame portion,
• wherein the inner region of the second frame portion encompasses, in a plan view, the inner region of the first frame portion, the inner region of the second frame portion defined by an inner peripheral edge of the second frame portion, and
• wherein the second frame portion is disposed at a predetermined distance from the edge of the second insulation layer that defines the opening portion.