Electronic component device and method for manufacturing the same

An electronic component device comprising:

• a first coreless wiring substrate;
• an electronic component that is mounted on the first coreless wiring substrate;
• a second coreless wiring substrate that is disposed above the first coreless wiring substrate and the electronic component such that the second coreless wiring substrate is spaced from the first coreless wiring substrate and the electronic component;
• a connection terminal that connects the first coreless wiring substrate and the second coreless wiring substrate;
• and
• a sealing resin that is filled between the first and second coreless wiring substrates,
• wherein the first coreless wiring substrate comprises a first insulating layer, a first wiring layer, and a first reinforcing layer that is embedded in the first insulating layer and provided in a region overlaying the electronic component,
• wherein the second coreless wiring substrate comprises a second insulating layer, a second wiring layer, and a second reinforcing layer that is embedded in the second insulating layer and provided in a region overlaying the electronic component, and
• wherein the second insulating layer comprises a first surface and a second surface opposite to the first surface, the first surface of the second insulating layer being opposed to the electronic component, the second surface of the second insulating layer being flush with a surface of the second reinforcing layer, and the second surface of the second insulating layer and the surface of the second reinforcing layer being exposed to an outside of the electronic component device.