Interposer with offset-stacked traces
AssigneeSeagate Technology LLC
InventorsMichael J. Peterson, Michael R. Fabry, Sean M. Horgan
Life of this patent
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Abstract
Aspects of the disclosure are directed to apparatuses and methods involving an electrical connector and methods thereof. As may be consistent with one or more embodiments, an interposer includes respective barrier layers having barrier material that is coplanar with, and laterally surrounds, traces having connected via pads. Vias connect pads of stacked pairs of the traces in different ones of the barrier layers. The traces vary in width along their respective lengths. The barrier material is offset from each trace by a continuous gap having a length extending around the trace, with the gaps extending around each stacked pair being offset from one another along the majority of their respective lengths.
Claims20
An electrical interposer apparatus comprising:
- a first surface layer having a plurality of electrical connectors;
- a second surface layer having a plurality of electrical connectors, the first and second surface layers being on opposite sides of the electrical interposer;
- first and second barrier layers stacked between the first surface layer and the second surface layer, each of the barrier layers including:
- a plurality of conductive traces, each conductive trace including respective via pads connected by a connector and having a width that varies along its length, and
- conductive barrier material that is coplanar with and laterally surrounds the conductive traces, the conductive barrier material being offset from the plurality of conductive traces by a continuous gap having a length extending around the conductive traces;
- and
- a plurality of conductive vias that connect the via pads of stacked pairs of the conductive traces, one of the stacked pairs being in the first barrier layer and the other of the stacked pairs being in the second barrier layer, wherein the respective gaps extending around each stacked pair are offset from one another along the majority of the respective lengths of the gaps.
A method of manufacturing an electrical interposer apparatus, the method comprising:
- forming first and second barrier layers, each of the barrier layers including:
- a plurality of conductive traces, each conductive trace including respective via pads connected by a connector and having a width that varies along its length, and
- conductive barrier material that is coplanar with and laterally surrounds the conductive traces, the conductive barrier material being offset from the plurality of conductive traces by a continuous gap having a length extending around the conductive traces;
- and
- forming a plurality of conductive vias that connect the via pads of stacked pairs of the conductive traces, one of the stacked pairs being in the first barrier layer and the other of the stacked pairs being in the second barrier layer, wherein the respective gaps extending around each stacked pair are offset from one another along the majority of the respective lengths of the gaps.
Dependencies are inferred from the claim text.