Method of manufacturing flexible printed circuit board with component mounting section for mounting electronic component and flexible cable sections extending in different directions from the component mounting section

A method of manufacturing a flexible printed circuit board, comprising:

• manufacturing a plurality of first partial flexible printed circuit boards each of which includes a first partial component mounting section having a first land formed on a surface thereof and a flexible cable section extending from the first partial component mounting section;
• manufacturing a plurality of second partial flexible printed circuit boards each of which includes a second partial component mounting section having a second land formed on a surface thereof and an interlayer conduction path electrically connected with the second land and a flexible cable section extending from the second partial component mounting section;
• forming a lower flexible printed circuit board by performing an alignment so that the first partial component mounting sections of the two first partial flexible printed circuit boards are arranged on the same plane and configure a lower component mounting section and then fixing the two first partial flexible printed circuit boards onto a support plate;
• forming an upper flexible printed circuit board by performing an alignment so that the second partial component mounting sections of the two second partial flexible printed circuit boards are arranged on the same plane and configure an upper component mounting section and then fixing the two second partial flexible printed circuit boards onto an anisotropic conductive film containing a conductive particle therein;
• and
• forming a component mounting section in which the upper component mounting section is stacked on the lower component mounting section and the first land is electrically connected with the second land positioned directly thereon through the conductive particle and the interlayer conduction path, by placing the upper flexible printed circuit board on the lower flexible printed circuit board and performing heating pressurizing.