Method for making circuit board

A method for making a circuit board comprising:

• providing a copper clad laminate, the copper clad laminate comprises a substrate and at least one copper layer, the substrate comprises at least one first surface, each of the at least one copper layer is attached to one of the at least one first surface;
• etching the at least one copper layer to form at least one conductive circuit layer, a portion of each of the at least one first surface is exposed through one of the at least one conductive circuit layer, each of the at least one conductive circuit layer comprises a second surface away from the substrate;
• forming a dry film pattern layer, the dry film pattern layer covers the exposed portion of each of the at least one first surface, and a portion of the second surface, the other portion of the second surface not being covered by the dry film pattern layer is an exposing area;
• forming at least two plating films on the exposing area, each of the at least two plating films comprises a third surface away from the second surface and at least one side surface connecting the second surface and the third surface;
• removing the dry film pattern layer;
• forming at least one through hole to form an intermediate product, each of the at least one through hole is located between two adjacent ones of the at least two plating films, each of the at least one through hole passes through the substrate, and the at least one conductive circuit layer;
• providing at least one adhesive sheet, each of the at least one adhesive sheet comprises at least one opening, each of the at least one opening is aligned with the third surface of each of the at least two plating films;
• and
• pressing the at least one adhesive sheet and the intermediate product, the opening exposes at least a portion of the third surface.