Electronic device, method for producing same, and circuit substrate

A method of producing an electronic device including a substrate, a region provided on the substrate and configured to mount an electronic component therein, a first circuit pattern placed within the region and electrically connected to the electronic component, a second circuit pattern connected to the first circuit pattern and configured to supply current to the first circuit pattern from outside of the region, and the electronic component mounted within the region and connected to the first circuit pattern, wherein at least a part of the first circuit pattern comprises a layer obtained by sintering conductive nanosized particles with a particle diameter of less than 1 μm, and the second circuit pattern is thicker than the first circuit pattern, the method comprising:

• step 1:
• forming a film by applying:
• a solution wherein the conductive nanosized particles with a particle diameter of less than 1 μm and an insulating material are dispersed, or
• a solution wherein the conductive nanosized particles coated with a layer of the insulating material are dispersed,
• to a surface of the substrate in a desired pattern,
• step 2:
• forming the first circuit pattern of a layer of the conductive nanosized particles in a predetermined pattern by irradiating the film with light in the predetermined pattern and sintering the conductive nanosized particles by the light,
• step 3:
• connecting electrodes of the electronic component with the layer of the conductive nanosized particles, after the electronic component is mounted on the film, and
• step 4:
• forming the second circuit pattern on the surface of the substrate, continuously from the first circuit pattern,
• wherein the second circuit pattern is formed with a film that is thicker than the first circuit pattern.