Placement of vias in printed circuit board circuits

A method for constructing a printed circuit board (PCB), the method comprising:

• drilling a first trace via, a second trace via, a first ground via, a second ground via, a third ground via, and a fourth ground via in the PCB;
• filling the first trace via, a second trace via, a first ground via, a second ground via, a third ground via, and a fourth ground via with conductive material;
• forming a first pad on a first layer of the PCB that is electrically connected to the conductive material of the first trace via;
• forming a second pad on a second layer that is electrically connected to the conductive material of the second trace via;
• forming a first ground pad on the first layer that is electrically connected to the conductive material of the first ground via, wherein the first ground pad is positioned between the first trace and the second trace;
• forming a second ground pad on the first layer that is electrically connected to the conductive material of the second ground via, wherein the first ground pad and the second ground pad are approximately symmetrically positioned about a perpendicular bisector of a line from the first pad to the second pad;
• forming a third ground pad on the first layer that is electrically connected to the conductive material of the third ground via;
• forming a fourth ground pad on the first layer that is electrically connected to the conductive material of the fourth ground via, wherein the third ground pad and the fourth ground pad are approximately symmetrically positioned about the perpendicular bisector;
• etching an antipad surrounding the first trace via and the second trace via;
• and
• forming a first trace on the first layer and a second trace on the second layer, wherein the first trace is electrically connected to the first pad, and wherein the second trace is electrically connected to the second pad.